XC6VSX475T-1FF1759I

The XC6VSX475T-1FF1759I is a Virtex®-6 SXT FPGA from AMD provided in a 1759-ball FCBGA package. It integrates a large logic fabric and substantial on-chip memory to support designs that require high logic capacity and extensive I/O connectivity.

Key platform attributes include 476,160 logic elements, approximately 39.2 Mbits of embedded memory, 840 user I/O pins, industrial-grade temperature range (−40 °C to 100 °C), and a core supply voltage range of 0.95 V to 1.05 V. The device is RoHS compliant and supplied in a 1759-FCBGA (42.5×42.5 mm) surface-mount package.

Key Features

• Logic Capacity — Provides 476,160 logic elements to implement large-scale logic designs and complex processing pipelines.
• Embedded Memory — Approximately 39.2 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
• I/O Resources — 840 user I/O pins to support wide parallel interfaces and numerous external connections.
• Power Supply — Core voltage range from 0.95 V to 1.05 V to match system power architectures.
• Package and Mounting — 1759-ball FCBGA (42.5 × 42.5 mm) surface-mount package for high-density board implementations.
• Operating Range — Industrial-grade temperature rating from −40 °C to 100 °C for deployment in a wide range of environments.
• Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• High-density compute systems — Use the large logic element count and on-chip RAM to implement complex control and processing functions on a single device.
• Communications and I/O aggregation — 840 I/O pins enable aggregation and routing of numerous high-pin-count interfaces in networking or switching equipment.
• Industrial control and automation — Industrial temperature rating and robust packaging suit applications requiring extended environmental operation.

Unique Advantages

• Substantial logic resources: 476,160 logic elements reduce the need for multiple FPGAs or external glue logic.
• Large on-chip memory: Approximately 39.2 Mbits of embedded RAM supports buffering and local data storage to improve system efficiency.
• Extensive I/O: 840 user I/O pins provide flexibility for complex interfacing and parallel connectivity requirements.
• Industrial temperature support: Rated from −40 °C to 100 °C for deployment in demanding environments.
• Compact high-density package: 1759-FCBGA (42.5×42.5 mm) enables a high-pin-count solution in a surface-mount form factor.
• Regulatory readiness: RoHS compliance simplifies environmental compliance for manufactured products.

Why Choose XC6VSX475T-1FF1759I?

The XC6VSX475T-1FF1759I positions itself as a high-capacity, industrial-grade FPGA platform that brings together large logic resources, significant embedded memory, and a very high I/O count in a single FCBGA package. It is suitable for design teams that need to consolidate complex logic, memory buffering, and broad external connectivity into a single programmable device.

With industrial temperature support, RoHS compliance, and a clearly defined core voltage range, this Virtex®-6 SXT device offers a scalable and robust foundation for long-term deployments where logic density and I/O capacity are primary requirements.

Request a quote or submit a purchase inquiry to check availability and pricing for the XC6VSX475T-1FF1759I. Our team will respond with lead-time and procurement details tailored to your project needs.