XC6VSX475T-1FFG1156I

The XC6VSX475T-1FFG1156I is a Virtex-6 SXT field programmable gate array (FPGA) IC designed for high-density, industrial-grade digital designs. It combines a large programmable fabric with extensive I/O and embedded memory to support complex logic, signal processing, and system integration tasks.

With 476,160 logic elements, approximately 39.2 Mbits of on-chip RAM and 600 I/O pins, this device targets applications requiring significant logic capacity, substantial embedded memory, and broad external connectivity while operating across an industrial temperature range.

Key Features

• Core Logic  476,160 logic elements provide a high-capacity programmable fabric for complex digital designs and parallel processing tasks.
• Embedded Memory  Approximately 39.2 Mbits of on-chip RAM to support buffering, lookup tables, and in-system data storage without external memory in some use cases.
• I/O Density  600 I/O pins enable wide external connectivity for multi-channel interfaces, board-level integration, and complex system topologies.
• Power  Core supply operating range of 0.95 V to 1.05 V, allowing designs to target the specified voltage window for stable device operation.
• Package & Mounting  1156-FCBGA package (35×35 mm) in a surface-mount form factor for high-density PCB designs and reliable board assembly.
• Operating Range  Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant to meet environmental substance requirements.

Typical Applications

• Industrial Control  Use the high logic capacity and broad I/O to implement real-time control, motion control, and programmable automation functions within industrial systems.
• High-Density Signal Processing  Leverage the large fabric and embedded memory for digital signal processing tasks, data aggregation, and stream processing where on-chip resources reduce external memory dependency.
• Communication Systems  Deploy the device in communication and networking equipment that require many I/O channels and substantial programmable logic for protocol handling and packet processing.

Unique Advantages

• Substantial Logic Capacity: 476,160 logic elements enable complex, parallel designs and integration of multiple functions into a single device, reducing the need for multiple discrete chips.
• Significant On-Chip Memory: Approximately 39.2 Mbits of embedded RAM supports buffering and local data storage, improving throughput and lowering external memory requirements.
• High I/O Count: 600 I/O pins facilitate broad system interfacing, enabling connection to numerous peripherals, sensors, or high-channel-count front ends.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging industrial environments.
• Compact, Board-Level Package: The 1156-FCBGA (35×35 mm) surface-mount package supports high-density PCB integration while maintaining a rugged assembly footprint.
• Regulatory Compatibility: RoHS compliance helps meet environmental and regulatory requirements for modern electronic products.

Why Choose XC6VSX475T-1FFG1156I?

The XC6VSX475T-1FFG1156I positions itself as a high-capacity, industrial-grade FPGA that balances abundant programmable resources, significant embedded memory, and extensive I/O in a compact FCBGA package. It is suited to designers and system engineers building complex digital systems that require consolidation of functions, high channel counts, and operation across a wide temperature range.

This device delivers long-term value through scalable logic and memory resources that can accommodate evolving system requirements, while RoHS compliance and a surface-mount FCBGA package support modern manufacturing and environmental considerations.

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