XC6VSX475T-2FFG1759C

The XC6VSX475T-2FFG1759C is a Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC from AMD provided in a 1759-FCBGA surface-mount package. It delivers a large logic capacity with 476,160 logic elements, approximately 39.2 Mbits of embedded memory, and 840 I/O pins, all supported by a core supply range of 0.95 V to 1.05 V.

Designed for commercial-grade environments (0 °C to 85 °C) and RoHS compliant, this device is suited to designs that require high integration density, substantial on-chip memory, and extensive I/O connectivity.

Key Features

• Core / Logic Capacity 476,160 logic elements (cells)enable implementation of large-scale custom logic and complex algorithms within a single device.
• Embedded Memory Approximately 39.2 Mbits of on-chip RAM provide substantial buffering and storage for data-intensive operations.
• I/O Density 840 I/O pins support high fan-out connectivity for interfaces, peripherals, and multi-channel designs.
• Power / Voltage Core supply operating range of 0.95 V to 1.05 V for compatibility with target power architectures.
• Package & Mounting 1759-FCBGA (42.5 × 42.5 mm) / 1759-BBGA package in a surface-mount form factor for board-level integration.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard embedded applications.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density I/O Systems — Use the 840 I/O pins for complex interfacing, multi-channel I/O aggregation, and board-level connectivity.
• Large-Scale Logic Integration — Leverage 476,160 logic elements to consolidate extensive custom logic functions into a single FPGA
• On-chip Memory Buffering — Approximately 39.2 Mbits of embedded memory supports buffering, packet handling, and data staging within the FPGA fabric.

Unique Advantages

• High Integration Density: 476,160 logic elements let designers implement complex architectures on one device, reducing component count and board complexity.
• Substantial Embedded Memory: Approximately 39.2 Mbits of RAM enables on-chip data storage and buffering without external memory for many use cases.
• Extensive I/O Capacity: 840 I/O pins provide flexibility for multiple interfaces and parallel channels, simplifying external connectivity.
• Standard Commercial Grade: 0 °C to 85 °C operating range fits a wide range of commercial embedded applications.
• Surface-mount FCBGA Package: 1759-FCBGA (42.5 × 42.5 mm) supports compact board designs and high-density placement.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose XC6VSX475T-2FFG1759C?

The XC6VSX475T-2FFG1759C provides a balance of high logic capacity, significant on-chip memory, and wide I/O availability in a commercial-grade, surface-mount FCBGA package. Its voltage and temperature specifications make it suitable for demanding embedded applications that require consolidation of complex digital functions.

This FPGA is ideal for designers seeking to reduce BOM and board-level complexity by integrating large amounts of logic and memory into a single device while maintaining compliance with common environmental requirements. Documentation for the Virtex-6 family is available to support design and integration efforts.

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