XC6VSX315T-3FFG1759C

The XC6VSX315T-3FFG1759C is a Virtex®-6 SXT field programmable gate array (FPGA) provided in a 1759-FCBGA surface-mount package. It combines very large logic capacity, substantial on-chip RAM, and a high I/O count to address designs that require dense programmable logic and extensive connectivity.

With 314,880 logic elements, approximately 25.95 Mbits of embedded memory, and up to 720 I/Os, this commercial-grade device is aimed at complex digital designs that demand high integration and configurable resources within a single-package FPGA solution.

Key Features

• Logic Capacity — 314,880 logic elements and 24,600 CLBs provide extensive programmable logic resources for implementing large, complex designs.
• Embedded Memory — Approximately 25.95 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions within the FPGA fabric.
• I/O Density — Up to 720 I/Os to support large numbers of external interfaces and parallel signal connections.
• Power Supply — Core supply range from 950 mV to 1.05 V, enabling operation within defined core-voltage limits.
• Package and Mounting — 1759-FCBGA supplier package (42.5 × 42.5 mm) in a surface-mount form factor for board-level integration.
• Operating Range — Commercial grade with an operating temperature range of 0°C to 85°C.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• High-density logic implementations — Use where large quantities of programmable logic and CLBs are required to implement complex state machines, datapaths, or custom processors.
• Memory-intensive functions — Suitable for designs needing substantial embedded RAM for buffering, lookup tables, or packet/stream staging.
• Multi-channel I/O systems — Fit for applications requiring extensive parallel or diverse I/O connectivity, up to 720 signals.

Unique Advantages

• High logic integration: 314,880 logic elements and 24,600 CLBs enable consolidation of large functional blocks into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 25.95 Mbits of embedded RAM supports data buffering and local storage without external memory in many use cases.
• Large I/O capacity: Up to 720 I/Os allow direct interfacing to numerous peripherals, sensors, or parallel buses without external multiplexing.
• Compact FCBGA package: 1759-FCBGA (42.5 × 42.5 mm) surface-mount packaging provides a high-pin-count solution in a standardized footprint for dense PCB implementations.
• Commercial operating range: 0°C to 85°C grade suitable for standard commercial electronic applications.
• Regulatory alignment: RoHS compliance supports environmentally conscious design and procurement requirements.

Why Choose XC6VSX315T-3FFG1759C?

The XC6VSX315T-3FFG1759C positions itself as a high-capacity, highly integrated FPGA option for designers who need extensive programmable logic, significant embedded memory, and a large number of I/Os in a single commercial-grade package. Its combination of logic elements, CLBs, and on-chip RAM enables consolidation of complex functions and reduces external component needs.

Choose this Virtex®-6 SXT device when your design requires scalable logic resources, substantial local memory, and dense connectivity, all delivered in a surface-mount 1759-FCBGA package with RoHS compliance for standard commercial deployments.

Request a quote or submit a quotation request today to check availability and pricing for the XC6VSX315T-3FFG1759C. Our team can provide lead-time and purchasing details to support your project schedule.