XC6VSX315T-2FFG1759C

The XC6VSX315T-2FFG1759C is a Virtex®-6 SXT field programmable gate array (FPGA) IC from AMD designed for high-density, programmable logic applications. It provides 314,880 logic elements and approximately 25.95 Mbits of embedded memory, combined with up to 720 I/O, enabling complex on-chip logic, buffering and dense I/O interfacing within a 1759-FCBGA surface-mount package.

Supplied for commercial-grade use, the device operates from a core voltage range of 0.95 V to 1.05 V and across an ambient temperature range of 0 °C to 85 °C. The package and electrical characteristics make it suitable for designs requiring large logic capacity, significant on-chip memory, and a high I/O count.

Key Features

• Core Logic — 314,880 logic elements to implement large-scale custom digital functions and system logic.
• Embedded Memory — Approximately 25.95 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O Capacity — Up to 720 I/O pins, supporting dense peripheral and interface requirements in compact designs.
• Supply Voltage — Core voltage range of 0.95 V to 1.05 V to match system power rails and enable predictable power design.
• Package & Mounting — 1759-FCBGA (42.5 × 42.5 mm) surface-mount package (1759-BBGA, FCBGA) for board-level integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental conformance.

Typical Applications

• Custom digital logic implementations — Implement complex, application-specific logic functions using the device’s high logic element count and embedded memory.
• Dense I/O interfacing — Leverage up to 720 I/O pins for systems that require many external connections or mixed-signal front-ends.
• On-chip buffering and memory tasks — Use approximately 25.95 Mbits of embedded RAM for local data storage, buffering, and state machines.
• Board-level integration — 1759-FCBGA surface-mount packaging facilitates placement on compact, high-density PCBs.

Unique Advantages

• High logic density: 314,880 logic elements enable consolidation of large digital designs into a single FPGA, reducing board complexity.
• Significant on-chip memory: Approximately 25.95 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage needs.
• Extensive I/O: Up to 720 I/O allow integration of numerous peripherals and interfaces without additional multiplexing hardware.
• Commercial-grade operating range: 0 °C to 85 °C rating aligns with standard commercial electronic product requirements.
• RoHS compliant: Environmentally compliant manufacturing reduces regulatory and supply-chain concerns.
• Compact FCBGA package: 1759-FCBGA (42.5 × 42.5 mm) enables high-pin-count implementations in a board-friendly surface-mount format.

Why Choose XC6VSX315T-2FFG1759C?

The XC6VSX315T-2FFG1759C positions itself as a high-density FPGA option that combines large logic capacity, substantial embedded memory, and an extensive I/O complement in a single commercial-grade device. Its electrical and mechanical specifications support integration into designs that require concentrated programmable logic, on-chip RAM, and dense external connectivity.

This part is well suited to engineers and teams looking to consolidate complex digital functions onto a single FPGA, simplify board-level designs with fewer external components, and maintain predictable operation across standard commercial temperature and voltage ranges.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC6VSX315T-2FFG1759C. Our team will respond with commercial terms and ordering details tailored to your project needs.