XC6VSX315T-2FFG1156C

The XC6VSX315T-2FFG1156C is a Virtex‑6 SXT series FPGA from AMD offering a high count of programmable logic resources and on‑chip memory. With 314,880 logic elements, approximately 25.95 Mbits of embedded RAM and 600 user I/O pins, it is built for designs that require significant logic capacity, large embedded memory, and dense I/O integration. The device is supplied in a 1156‑FCBGA (35×35) surface‑mount package and operates on a 0.95 V to 1.05 V core supply at commercial temperature grades (0 °C to 85 °C).

Key Features

• Core Logic — 314,880 logic elements and 24,600 CLBs provide substantial programmable logic capacity for complex designs.
• Embedded Memory — Approximately 25.95 Mbits of on‑chip RAM to support buffering, packet processing, and intermediate storage without external memory.
• I/O Density — 600 I/O pins for high‑pin‑count interfacing and connectivity to peripherals and external devices.
• Power — Core voltage supply range of 0.95 V to 1.05 V for standard Virtex‑6 power domains.
• Package & Mounting — 1156‑FCBGA (35×35) package in a surface‑mount form factor suitable for compact board designs.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density programmable logic — Implement large, custom digital functions where extensive logic resources and embedded RAM are required.
• Interface aggregation — Use the high I/O count for bridging multiple high‑pin peripherals or consolidating interfaces on a single device.
• On‑chip data buffering — Leverage approximately 25.95 Mbits of RAM for packet buffering, FIFOs, and intermediate storage without relying on external memory.

Unique Advantages

• Substantial logic capacity: 314,880 logic elements support complex, large‑scale logic implementations and parallel processing architectures.
• Large embedded memory: Approximately 25.95 Mbits of on‑chip RAM reduces external memory dependence and simplifies board design.
• Extensive I/O availability: 600 I/O pins enable dense connectivity and flexible system partitioning.
• Compact FCBGA package: 1156‑FCBGA (35×35) provides a high pin‑count footprint in a single surface‑mount package for space‑constrained PCBs.
• Commercial temperature grade: Rated 0 °C to 85 °C for a wide range of standard electronic applications.
• RoHS compliant: Environmentally compliant for markets requiring lead‑free components.

Why Choose XC6VSX315T-2FFG1156C?

The XC6VSX315T-2FFG1156C combines a very large complement of logic elements, substantial embedded RAM and a high I/O count within a 1156‑FCBGA surface‑mount package. This combination suits designs that need significant on‑chip resources and dense interfacing while maintaining a compact board footprint. Its commercial temperature rating and RoHS compliance support standard production deployments where these attributes are required.

For engineering teams evaluating platform choices, the device offers clear integration advantages by consolidating logic, memory and I/O capacity into a single FPGA—simplifying BOMs and enabling scalable designs that leverage the Virtex‑6 SXT architecture.

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