XC6VSX315T-2FFG1156I

The XC6VSX315T-2FFG1156I is a Virtex®-6 SXT field programmable gate array (FPGA) IC designed for applications that require large programmable logic capacity and substantial on-chip RAM. It combines a high count of logic elements with abundant embedded memory and I/O to support complex digital designs.

Packaged in a 1156-ball FCBGA (35 × 35 mm) and rated for industrial temperatures, this device targets designs that need significant integration density while operating across a wide supply and temperature range.

Key Features

• Core architecture Virtex®-6 SXT FPGA core provided in the XC6VSX315T-2FFG1156I model for programmable digital logic implementation.
• Logic capacity 314,880 logic elements (cells) to implement large, high-complexity logic designs.
• On-chip memory Approximately 25.95 Mbits of embedded memory (25,952,256 total RAM bits) to support buffering, lookup tables, and state storage.
• I/O resources 600 user I/O pins enabling extensive interfacing with external devices and peripherals.
• Package and mounting 1156-BBGA / 1156-FCBGA (35×35 mm) package with surface-mount mounting type for compact board integration.
• Power supply Core voltage supply range from 0.950 V to 1.05 V to match system power requirements.
• Industrial temperature rating Operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
• RoHS compliant Built to meet RoHS environmental compliance requirements.

Typical Applications

• High-density digital processing Implement complex logic and data-path designs using the device's 314,880 logic elements and sizable embedded memory.
• Protocol bridging and I/O aggregation Use the 600 I/O pins to consolidate multiple interfaces and perform protocol translation or aggregation on a single device.
• Industrial control systems Leverage the industrial temperature rating (−40 °C to 100 °C) for deployed control and automation equipment requiring extended thermal range.

Unique Advantages

• Large programmable capacity: 314,880 logic elements provide the headroom needed for complex state machines, datapaths, and custom logic blocks.
• Substantial on-chip memory: Approximately 25.95 Mbits of embedded RAM reduces reliance on external memory for buffers and lookup tables.
• Extensive I/O connectivity: 600 I/O pins support multiple external interfaces, reducing the need for extra glue logic or I/O expanders.
• Industrial-ready thermal range: Rated for −40 °C to 100 °C to support deployment in industrial environments without additional thermal qualification.
• Compact, surface-mount package: The 1156-FCBGA (35×35 mm) package enables high-density PCB layouts while maintaining robust electrical connections.
• Controlled core voltage range: Core supply between 0.950 V and 1.05 V provides defined power requirements for system power delivery design.

Why Choose XC6VSX315T-2FFG1156I?

The XC6VSX315T-2FFG1156I balances large logic capacity, significant embedded memory, and extensive I/O in a single industrial-grade FPGA package. Its specification set—314,880 logic elements, approximately 25.95 Mbits of on-chip RAM, and 600 I/O pins—makes it suited to designs that require consolidation of complex digital functions and ample local storage.

This device is appropriate for engineers and procurement teams seeking a high-density FPGA with industrial temperature capability, a compact 1156-FCBGA footprint, and clearly defined power and mounting characteristics for reliable integration into production systems.

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