XC6VLX365T-3FFG1156C

The XC6VLX365T-3FFG1156C is a Virtex®-6 LXT FPGA from AMD, delivering a high-density, programmable logic fabric in a 1156-ball FCBGA package. It combines a large logic capacity with substantial on-chip memory and a high I/O count for demanding digital designs.

This device is targeted at applications that require extensive logic resources, significant embedded RAM, and a large number of user I/Os, while operating within commercial temperature and supply ranges.

Key Features

• Logic Capacity  Approximately 364,032 logic elements to support complex, high-density programmable logic implementations.
• Configurable Logic Blocks (CLBs)  Approximately 28,440 configurable logic blocks (CLBs) for flexible design partitioning and resource allocation.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM for buffering, state storage, and data-path acceleration without external memory dependence.
• I/O Resources  Up to 600 user I/Os to support wide parallel interfaces, multiple peripheral connections, and high-pin-count system integration.
• Package & Mounting  1156-ball FCBGA (35 × 35 mm) package in a surface-mount form factor for compact board-level integration.
• Power Supply  Core voltage range of 0.95 V to 1.05 V, enabling predictable power planning for system designs.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C, suitable for standard temperature-range electronic systems.
• Compliance  RoHS compliant construction for regulatory compatibility in applicable markets.

Typical Applications

• High-density digital processing  Implement complex datapaths and custom logic where large logic element counts are required.
• I/O-intensive systems  Integrate multiple parallel interfaces and peripherals using the device's up to 600 user I/Os.
• On-chip buffering and stateful functions  Leverage approximately 15.3 Mbits of embedded memory for FIFO, cache, and scratchpad implementations.
• Compact board-level integration  Deploy the 1156-FCBGA surface-mount package in space-constrained designs that need high gate and I/O density.

Unique Advantages

• High integration density:  Large logic and memory resources reduce the need for external components and simplify system architecture.
• Extensive I/O count:  600 available I/Os enable direct interfacing to many peripherals and high-pin-count buses without multiplexing compromises.
• Predictable power envelope:  A defined core voltage range (0.95–1.05 V) assists in power-tree design and thermal planning.
• Commercial temperature profile:  Rated for 0 °C to 85 °C operation, matching requirements for mainstream electronic applications.
• RoHS compliance:  Manufactured to meet RoHS requirements for environmental and regulatory considerations.
• Industry-standard package:  1156-ball FCBGA (35 × 35 mm) facilitates integration into established PCB assembly processes.

Why Choose XC6VLX365T-3FFG1156C?

The XC6VLX365T-3FFG1156C positions itself as a high-density Virtex®-6 LXT FPGA option from AMD, offering a combination of extensive logic resources, substantial embedded RAM, and a large I/O complement in a compact FCBGA package. These characteristics make it suitable for system designs that demand significant on-chip resources while maintaining a commercial temperature profile.

Choose this device when your design requires scalable programmable logic capacity, ample on-chip memory for performance-sensitive functions, and a high I/O count for broad interfacing — all backed by AMD as the manufacturer.

Request a quote or submit an inquiry to obtain pricing, availability, and delivery options for the XC6VLX365T-3FFG1156C.