XC6VLX365T-2FFG1156I

The XC6VLX365T-2FFG1156I is a Virtex-6 LXT FPGA IC in a 1156-ball FCBGA package designed for high-density programmable logic applications. It delivers substantial on-chip resources—364,032 logic elements and approximately 15.3 Mbits of embedded RAM—together with up to 600 I/O pins and industrial-grade temperature capability for demanding system designs.

This device is suited to designs that require high integration, extensive I/O connectivity, and significant embedded memory while operating across a wide voltage supply range (0.95 V to 1.05 V) and industrial temperature conditions.

Key Features

• Core Logic  364,032 logic elements for implementing large-scale digital logic and custom hardware functions.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage without external memory.
• I/O Density  Up to 600 I/O pins to enable extensive peripheral interfacing and high-bandwidth system connectivity.
• Power Supply  Operates from a core voltage range of 0.95 V to 1.05 V to match modern system power rails and regulator designs.
• Package & Mounting  1156-BBGA (FCBGA) supplier device package (35 × 35 mm) with surface-mount mounting for compact board-level integration.
• Temperature & Grade  Industrial-grade device specified for operation from −40 °C to 100 °C, suitable for industrial and other temperature-demanding environments.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

• High-density logic systems  Implement complex custom logic and state machines using hundreds of thousands of logic elements.
• Memory-intensive designs  Use the on-chip RAM for buffering, packet processing, or lookup functions without immediate need for external memory.
• Multi-I/O platforms  Integrate with numerous peripherals and high-pin-count interfaces leveraging up to 600 I/O pins.
• Industrial control and automation  Deploy in industrial-grade systems that require operation across −40 °C to 100 °C.

Unique Advantages

• High integration density: 364,032 logic elements reduce the need for multiple devices, lowering BOM complexity and board space.
• Significant on-chip memory: Approximately 15.3 Mbits of embedded RAM supports data-heavy logic and reduces dependence on external memory components.
• Extensive I/O capability: Up to 600 I/O pins enable broad peripheral and interface support in a single FPGA package.
• Industrial temperature range: Specified −40 °C to 100 °C for dependable operation in temperature-challenging environments.
• Compact FCBGA package: 1156-ball, 35 × 35 mm package balances high pin count with space-efficient surface-mount mounting.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing and regulatory requirements.

Why Choose XC6VLX365T-2FFG1156I?

The XC6VLX365T-2FFG1156I positions itself as a highly integrated Virtex-6 LXT FPGA option for designs that demand large programmable logic capacity, substantial embedded memory, and broad I/O connectivity in an industrial-grade package. Its combination of 364,032 logic elements, approximately 15.3 Mbits of on-chip RAM, and 600 I/O pins makes it well suited to complex system designs that seek to consolidate functions into a single device.

Engineers and procurement teams building industrial systems or high-density digital platforms will find this device offers scalability and integration that help simplify board design and reduce component count, with RoHS compliance supporting modern assembly workflows.

Request a quote or submit a quote inquiry to receive pricing and availability information for the XC6VLX365T-2FFG1156I.