XC6VLX365T-1FF1156I

The XC6VLX365T-1FF1156I is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC designed to deliver high-density programmable logic and extensive I/O capability. Its architecture targets designs that require large amounts of on-chip logic, substantial embedded memory, and an industrial operating range.

With 364,032 logic elements, approximately 15.3 Mbits of embedded memory and up to 600 I/O pins, this device is suited to systems needing significant integration of digital logic and external interfacing while maintaining industrial temperature and RoHS compliance.

Key Features

• High‑density Core 364,032 logic elements with approximately 28,440 configurable logic blocks (CLBs) to support complex programmable logic implementations.
• Embedded Memory Approximately 15.3 Mbits of on‑chip RAM (15,335,424 total RAM bits) for local data buffering and storage.
• Extensive I/O Up to 600 user I/O pins to support broad interfacing with peripherals, sensors, and external devices.
• Power Core supply voltage range of 0.95 V to 1.05 V to match platform power domains and regulators.
• Package and Mounting 1156‑FCBGA (35×35) package case (1156‑BBGA, FCBGA) in a surface‑mount form factor for high‑density board integration.
• Industrial Reliability Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulated environments.

Typical Applications

• Industrial Control Systems — Use the device's high logic density and industrial temperature range for control, sequencing, and real‑time processing tasks in automated equipment.
• High‑Density Digital Processing — Leverage the large number of logic elements and embedded RAM for custom data processing, protocol handling, and signal aggregation.
• System Integration and I/O Expansion — Deploy up to 600 I/O pins to interface multiple peripherals, sensors, and external subsystems on a single FPGA platform.

Unique Advantages

• Significant On‑Chip Logic Capacity: 364,032 logic elements provide room to implement large, complex designs without immediate partitioning across multiple devices.
• Substantial Embedded Memory: Approximately 15.3 Mbits of RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O Count: 600 I/O pins enable extensive device and board-level connectivity for multi‑channel systems.
• Industrial Operating Range: Rated from −40 °C to 100 °C to support deployment in demanding environmental conditions.
• Industry‑standard Package: 1156‑FCBGA (35×35) surface‑mount package supports high‑density PCB designs and assembly workflows.
• Regulatory Compliance: RoHS compliant to meet environmental and regulatory requirements for many commercial and industrial products.

Why Choose XC6VLX365T-1FF1156I?

The XC6VLX365T-1FF1156I positions itself as a high‑capacity, industrial‑grade FPGA suitable for designs that require a large amount of on‑chip logic, significant embedded memory, and extensive I/O connectivity. Its combination of 364,032 logic elements, approximately 15.3 Mbits of RAM, and 600 I/O pins makes it a strong candidate for system integration tasks where consolidation of digital functions is a priority.

Backed by AMD manufacturing and supplied in a compact 1156‑FCBGA surface‑mount package, this device offers durability across a wide temperature range and compliance with RoHS directives—providing a scalable, robust building block for long‑lived industrial and high‑density digital systems.

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