XC6VLX240T-L1FFG1156C

The XC6VLX240T-L1FFG1156C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1156-ball FCBGA package. It delivers a high density of programmable logic and I/O, making it suitable for designs that require substantial on-chip logic capacity and a large number of external interfaces.

Key strengths are its logic capacity, embedded memory, and extensive I/O capability, providing architects with a flexible platform for complex, high-density digital designs while operating within a commercial temperature range.

Key Features

• High Logic Capacity  Provides 241,152 logic elements for implementing large-scale programmable logic and complex digital functions.
• Embedded Memory  Contains approximately 15.3 Mbits of on-chip RAM to support buffering, packet processing, and other memory-intensive tasks without external memory.
• Extensive I/O  Up to 600 I/O pins enable dense connectivity to peripherals, sensors, and high-pin-count interfaces.
• Package and Mounting  Packaged in a 1156-BBGA FCBGA (35 × 35 mm) suitable for surface-mount PCB assembly.
• Power Supply Range  Nominal core voltage range of 870 mV to 930 mV, allowing designers to plan power delivery and sequencing precisely.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• High-density digital systems  Implement large programmable logic functions where hundreds of thousands of logic elements are required.
• Data buffering and packet processing  Leverage approximately 15.3 Mbits of embedded memory to support on-chip data storage and real-time processing tasks.
• Multi-interface controllers  Use up to 600 I/O pins to integrate multiple high-pin-count peripherals and I/O standards on a single FPGA.
• Prototyping and system integration  Serve as a flexible platform for consolidating discrete logic and validating complex digital subsystems in commercial designs.

Unique Advantages

• Large logic fabric: 241,152 logic elements enable consolidation of complex functions that would otherwise require multiple discrete devices.
• Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM reduce dependence on external memory for many buffering and processing needs.
• High I/O density: 600 I/O pins support extensive external connectivity, simplifying board-level routing for multi-interface applications.
• Compact FCBGA package: 1156-ball FCBGA (35 × 35 mm) provides a high-pin-count solution in a compact surface-mount form factor.
• Predictable commercial operation: Specified 0 °C to 85 °C temperature range and defined core voltage window aid in reliable system-level design and validation.
• RoHS compliance: Meets environmental requirements for lead-free assembly and regulatory compliance in commercial products.

Why Choose XC6VLX240T-L1FFG1156C?

The XC6VLX240T-L1FFG1156C positions itself as a high-density Virtex®-6 LXT FPGA option for commercial applications that demand extensive logic resources, significant embedded memory, and large I/O counts. Its combination of 241,152 logic elements, approximately 15.3 Mbits of on-chip RAM, and 600 I/O pins makes it well suited for designers consolidating complex digital functions into a single programmable device.

Backed by AMD manufacturing and RoHS compliance, this device is appropriate for development and deployment in commercial product lines where scalability, integration, and predictable electrical and thermal characteristics are required.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing, and lead times for the XC6VLX240T-L1FFG1156C. Our specialists can provide procurement guidance and help align the device with your design and production requirements.