XC6VLX240T-3FFG1156C

The XC6VLX240T-3FFG1156C is a Virtex-6 LXT field programmable gate array (FPGA) manufactured by AMD, delivered in a 1156-FCBGA (35×35) package. It provides a large programmable fabric with 241,152 logic elements and approximately 15.33 Mbits of embedded RAM, alongside 600 I/O to support dense system integration.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 0.95–1.05 V core supply and across an operating temperature range of 0 °C to 85 °C, and it is RoHS compliant.

Key Features

• Core Logic 241,152 logic elements for implementing complex digital logic and custom hardware accelerators.
• Embedded Memory Approximately 15.33 Mbits of on-chip RAM to support buffering, FIFOs and local data storage for high-throughput designs.
• I/O Capacity 600 I/O pins to accommodate wide parallel interfaces, multiple peripherals, or dense board-level connectivity.
• Package and Mounting 1156-FCBGA (35×35) package in a surface-mount form factor for compact, high-density board designs.
• Power Core voltage supply range of 0.95–1.05 V to match system power requirements.
• Temperature and Grade Commercial grade device specified for 0 °C to 85 °C operation.
• Compliance RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• Custom digital acceleration Implement custom processing pipelines and hardware accelerators using the large logic capacity and embedded RAM to offload compute from processors.
• High-density I/O systems Use the 600 I/O pins to interface with multiple sensors, transceivers, or parallel buses in communication and data-acquisition systems.
• Prototyping and system integration Leverage the surface-mount 1156-FCBGA package and extensive logic resources for board-level prototyping and integration of complex digital subsystems.

Unique Advantages

• High logic capacity: 241,152 logic elements enable implementation of large, complex FPGA designs without immediate need to partition across multiple devices.
• Significant on-chip memory: Approximately 15.33 Mbits of embedded RAM reduces external memory dependence and improves throughput for buffering and local storage.
• Extensive connectivity: 600 I/O pins support dense, flexible board-level interfaces and multiple parallel channels.
• Compact, manufacturable package: 1156-FCBGA (35×35) surface-mount package supports high-density PCB layouts and automated assembly.
• Commercial operating range: Specified for 0 °C to 85 °C operation to meet typical commercial deployment environments.
• Regulatory compliance: RoHS compliant for environmental conformity in standard production and distribution.

Why Choose XC6VLX240T-3FFG1156C?

The XC6VLX240T-3FFG1156C delivers a balance of high programmable logic capacity, substantial on-chip memory, and extensive I/O in a compact 1156-FCBGA package. Its specifications make it well suited for designers who need to implement large custom logic functions, integrate multiple interfaces, and keep critical data close to the fabric for performance.

Manufactured by AMD and offered as a commercial-grade, RoHS-compliant device, this Virtex-6 LXT FPGA is targeted at teams and projects that require scalable logic resources and dense I/O in a surface-mount form factor.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the XC6VLX240T-3FFG1156C. Our team can provide lead-time and ordering support to help integrate this FPGA into your next design.