XC6VLX240T-2FFG1759I
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 720 15335424 241152 1759-BBGA, FCBGA |
|---|---|
| Quantity | 90 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1759-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1759-BBGA, FCBGA | Number of I/O | 720 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 18840 | Number of Logic Elements/Cells | 241152 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15335424 |
Overview of XC6VLX240T-2FFG1759I – Virtex®-6 LXT FPGA, 1759-FCBGA
The XC6VLX240T-2FFG1759I is a Virtex®-6 LXT field-programmable gate array provided in a high-density 1759-FCBGA package. This industrial-grade FPGA delivers large programmable logic capacity, substantial on-chip memory, and a broad I/O count for complex digital designs.
Key value propositions include high logic integration, significant embedded memory, and industrial temperature capability—designed for applications that require dense programmable logic and robust operating conditions.
Key Features
- Core Logic 241,152 logic elements provide a high level of programmable logic for complex, high-density designs.
- Configurable Logic Blocks (CLBs) 18,840 CLBs support large-scale logic implementation and flexible design partitioning.
- On‑Chip Memory Approximately 15.3 Mbits of embedded memory to support buffering, state machines, and data-intensive logic functions.
- I/O Capacity 720 user I/O pins to interface with wide peripheral sets and parallel data paths.
- Package & Mounting Supplied in a 1759-BBGA (1759-FCBGA) package, supplier device package: 1759-FCBGA (42.5x42.5), with surface-mount mounting for standard PCB assembly.
- Power Supply Core voltage supply range from 950 mV to 1.05 V to match system power domains.
- Operating Temperature Rated for industrial temperature operation from −40°C to 100°C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Industrial-grade temperature rating and high I/O count support programmable logic for control systems and automation equipment.
- High‑Density Digital Processing Large logic element count and approximately 15.3 Mbits of embedded memory enable data-path intensive processing and complex state machines.
- Custom Interface Aggregation 720 I/O pins allow aggregation and bridging of multiple parallel and serial interfaces in a single programmable device.
Unique Advantages
- High Integration Density: 241,152 logic elements and 18,840 CLBs reduce the need for multiple devices in complex designs.
- Substantial Embedded Memory: Approximately 15.3 Mbits of on‑chip RAM supports large buffers and local data storage without external memory.
- Extensive I/O: 720 I/O pins simplify system integration by supporting numerous peripherals and parallel interfaces directly.
- Industrial Temperature Range: Rated from −40°C to 100°C for reliable operation in demanding environments.
- Compact, Surface‑Mount Package: 1759-FCBGA packaging (42.5x42.5) provides a compact footprint for high-density PCB layouts.
- Regulatory Compliance: RoHS compliant to support environmentally conscious manufacturing requirements.
Why Choose XC6VLX240T-2FFG1759I?
The XC6VLX240T-2FFG1759I positions itself as a high-capacity, industrial-grade FPGA offering substantial logic, memory, and I/O in a compact FCBGA package. Its combination of 241,152 logic elements, approximately 15.3 Mbits of embedded memory, and 720 I/Os makes it well suited to engineers designing dense digital systems that require on‑chip resources and robust operating temperatures.
Choose this device for designs that need scalability and integration in industrial environments—where logic density, embedded memory, and a broad I/O set translate into reduced board-level complexity and flexible, long-term deployment.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for XC6VLX240T-2FFG1759I.

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