XC6VLX240T-2FFG1156C

The XC6VLX240T-2FFG1156C is a Virtex‑6 LXT field programmable gate array (FPGA) supplied by AMD. It provides a high-density programmable logic fabric coupled with substantial on‑chip memory and a large number of I/O pins for system-level integration.

With 241,152 logic elements, approximately 15.3 Mbits of embedded memory and 600 I/O, this device addresses designs that require significant logic capacity, abundant I/O connectivity and on‑chip storage while maintaining a commercial temperature rating and standard surface-mount package options.

Key Features

• Core Capacity – 241,152 logic elements and 18,840 CLBs provide extensive programmable logic resources for complex digital designs.
• Embedded Memory – Approximately 15.3 Mbits of on‑chip RAM to support buffering, state storage and intermediate data processing without external memory.
• I/O Density – 600 user I/O pins enable broad interface support and high channel counts for multi‑lane or multi‑peripheral systems.
• Power Supply – Operates from a core supply range of 0.95 V to 1.05 V, suitable for systems designed around modern FPGA core voltages.
• Package & Mounting – 1156‑BBGA FCBGA package (supplier device package: 1156‑FCBGA, 35×35) in a surface‑mount form factor for compact board integration.
• Temperature & Grade – Commercial grade device specified for operation from 0°C to 85°C.
• Environmental Compliance – RoHS compliant for conformity with common lead‑free manufacturing requirements.

Typical Applications

• High‑density digital processing – Implement complex logic functions and parallel processing pipelines using large logic and memory resources.
• Multi‑interface communication systems – Support multiple high‑pincount interfaces and protocol bridges with 600 I/O pins.
• Board‑level system integration – Integrate core logic, glue logic and on‑chip buffering in a single FCBGA package to reduce external components.

Unique Advantages

• High logic capacity: 241,152 logic elements and 18,840 CLBs enable consolidation of complex functions onto a single device, reducing board-level partitioning.
• Significant on‑chip memory: Approximately 15.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful tasks.
• Extensive I/O connectivity: 600 I/O pins support multi‑lane interfaces, dense connector arrays, and multiple peripheral connections without external multiplexing.
• Compact package: 1156‑ball FCBGA (35×35) surface‑mount package provides a compact, high‑pin‑count option for board space constrained designs.
• Commercial temperature rating: Specified 0°C to 85°C operation simplifies qualification for standard commercial applications.
• RoHS compliant: Meets common lead‑free assembly requirements for global manufacturing.

Why Choose XC6VLX240T-2FFG1156C?

The XC6VLX240T-2FFG1156C combines large programmable logic capacity, substantial embedded memory and a high I/O count in a compact 1156‑FCBGA surface‑mount package. Its specification set is suited to designs that require consolidation of complex logic functions and multiple I/O interfaces while maintaining a commercial operating temperature range.

For engineers and procurement teams seeking a high‑density Virtex‑6 LXT FPGA from AMD with clear, verifiable specifications—including core voltage range, on‑chip memory and physical package details—this device delivers the resources needed for advanced board‑level integration and system consolidation.

Request a quote or submit an inquiry to evaluate XC6VLX240T-2FFG1156C for your next design and obtain pricing and availability information.