XC6VLX240T-2FF1156I

The XC6VLX240T-2FF1156I is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD, designed for high-density digital integration in industrial applications. It combines a large logic fabric with substantial embedded memory and a high I/O count to support complex system designs.

Key differentiators include approximately 241,152 logic elements, roughly 15.3 Mbits of on-chip RAM, and up to 600 I/Os, all delivered in a 1156-ball FCBGA (35 × 35 mm) surface-mount package with an industrial operating temperature range.

Key Features

• Core Logic  Approximately 241,152 logic elements provide a high-density programmable fabric for complex logic implementation.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM to support buffering, packet processing, and other memory-intensive functions.
• I/O Capacity  Up to 600 user I/Os for broad interfacing to peripherals, sensors, and external devices.
• Package & Mounting  1156-ball FCBGA package (1156-FCBGA, 35 × 35 mm) optimized for surface-mount assembly and high pin-count designs.
• Power  Core voltage supply range from 0.95 V to 1.05 V for defined power rail planning.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control  Use the industrial temperature rating and extensive I/O count to handle sensor and actuator interfaces, motor control glue logic, and machine automation tasks.
• High-Density Signal Processing  Leverage the large logic element count and on-chip memory to implement packet processing, protocol bridging, or real-time data manipulation.
• Prototyping and System Integration  Deploy as a central programmable fabric for system validation and integration where high logic capacity and flexible I/O are required.

Unique Advantages

• High logic density: Large logic-element count enables complex functions and integration of multiple subsystems into a single device, reducing component count.
• Substantial embedded memory: Approximately 15.3 Mbits of on-chip RAM supports buffering and state storage without external memory in many designs.
• Broad I/O connectivity: Up to 600 I/Os accommodate wide peripheral arrays and multiple interface standards on a single FPGA.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Board-level compatibility: 1156-ball FCBGA (35 × 35 mm) surface-mount package supports high-density PCB layouts and standard assembly processes.
• Regulatory compliance: RoHS compliant for streamlined lead-free product designs.

Why Choose XC6VLX240T-2FF1156I?

The XC6VLX240T-2FF1156I positions itself as a high-density, industrial-grade FPGA option for designs that need significant programmable logic, embedded memory, and extensive I/O in a single package. Its combination of approximately 241,152 logic elements, roughly 15.3 Mbits of on-chip RAM, and up to 600 I/Os makes it suitable for integration-heavy systems where consolidation and reliability matter.

Designed by AMD and delivered in a 1156-FCBGA surface-mount package with a wide operating temperature range and RoHS compliance, this device offers a platform that supports scalable designs and long-term deployment in industrial environments.

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