XC6VLX240T-1FFG1759C

IC FPGA 720 I/O 1759FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 720 15335424 241152 1759-BBGA, FCBGA

Quantity 1,521 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1759-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1759-BBGA, FCBGANumber of I/O720Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18840Number of Logic Elements/Cells241152
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15335424

Overview of XC6VLX240T-1FFG1759C – Virtex®-6 LXT FPGA (1759-FCBGA)

The XC6VLX240T-1FFG1759C is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD, delivered in a high-density 1759-FCBGA / 1759-BBGA package. It provides a combination of large logic capacity, embedded memory, and a high I/O count for complex programmable designs.

With 18,840 CLBs and 241,152 logic elements, plus approximately 15.3 Mbits of on-chip RAM and 720 I/O pins, this device is intended for applications that require substantial logic resources and dense connectivity while operating within a commercial temperature and standard supply range.

Key Features

  • Core Logic  Provides 18,840 CLBs delivering 241,152 logic elements to implement complex digital functions and custom logic architectures.
  • Embedded Memory  Approximately 15.3 Mbits of on-chip RAM for data buffering, lookup tables, and state storage within the FPGA fabric.
  • I/O Density  720 I/O pins to support extensive peripheral interfacing, multi-channel connectivity, and high-pin-count designs.
  • Package and Mounting  Available in 1759-BBGA / FCBGA form factor; supplier device package listed as 1759-FCBGA (42.5x42.5). Surface-mount device.
  • Supply Voltage  Operates from 950 mV to 1.05 V, supporting designs targeting this core supply range.
  • Temperature Range  Commercial-grade operation from 0 °C to 85 °C for standard ambient environments.
  • Standards Compliance  RoHS compliant, meeting common environmental and hazardous-substance requirements.

Typical Applications

  • Complex Digital Processing  Large logic capacity and embedded memory make this FPGA suitable for implementing extensive digital signal processing chains and custom datapaths.
  • High-density I/O Systems  720 I/O pins enable aggregation and routing of numerous interfaces, useful for multi-channel or multi-board systems.
  • Custom Logic Prototyping  Ample CLBs and logic elements support hardware prototyping and validation of large-scale, application-specific logic blocks.
  • Memory-intensive Functions  On-chip RAM resources support buffering, LUT-based storage, and intermediate data staging within the programmable fabric.

Unique Advantages

  • High Logic Capacity: 241,152 logic elements and 18,840 CLBs provide the headroom needed for large custom logic implementations.
  • Significant On-chip Memory: Approximately 15.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
  • Extensive Connectivity: 720 I/O pins allow flexible interfacing with multiple peripherals and high-channel-count designs.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.
  • RoHS Compliance: Meets RoHS requirements for designs targeting environmental and regulatory considerations.
  • Industry Manufacturer: Supplied by AMD, offering access to established documentation and product support resources.

Why Choose XC6VLX240T-1FFG1759C?

The XC6VLX240T-1FFG1759C positions itself as a high-capacity Virtex®-6 LXT FPGA option for projects that demand large logic arrays, substantial embedded memory, and high I/O counts within a commercial operating range. Its combination of 18,840 CLBs, 241,152 logic elements, and approximately 15.3 Mbits of on-chip RAM supports complex designs that require both compute fabric and internal storage.

This device is suited to design teams and procurement seeking a robust, high-density FPGA platform from a recognized manufacturer, with the package and electrical characteristics necessary for integration into surface-mount, board-level systems. The RoHS compliance and defined operating voltage and temperature ranges help ensure predictable behavior in standard commercial applications.

Request a quote or submit an inquiry to receive pricing, availability, and additional ordering information for the XC6VLX240T-1FFG1759C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up