XC6VLX240T-1FFG1759C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 720 15335424 241152 1759-BBGA, FCBGA |
|---|---|
| Quantity | 1,521 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1759-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1759-BBGA, FCBGA | Number of I/O | 720 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 18840 | Number of Logic Elements/Cells | 241152 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15335424 |
Overview of XC6VLX240T-1FFG1759C – Virtex®-6 LXT FPGA (1759-FCBGA)
The XC6VLX240T-1FFG1759C is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD, delivered in a high-density 1759-FCBGA / 1759-BBGA package. It provides a combination of large logic capacity, embedded memory, and a high I/O count for complex programmable designs.
With 18,840 CLBs and 241,152 logic elements, plus approximately 15.3 Mbits of on-chip RAM and 720 I/O pins, this device is intended for applications that require substantial logic resources and dense connectivity while operating within a commercial temperature and standard supply range.
Key Features
- Core Logic Provides 18,840 CLBs delivering 241,152 logic elements to implement complex digital functions and custom logic architectures.
- Embedded Memory Approximately 15.3 Mbits of on-chip RAM for data buffering, lookup tables, and state storage within the FPGA fabric.
- I/O Density 720 I/O pins to support extensive peripheral interfacing, multi-channel connectivity, and high-pin-count designs.
- Package and Mounting Available in 1759-BBGA / FCBGA form factor; supplier device package listed as 1759-FCBGA (42.5x42.5). Surface-mount device.
- Supply Voltage Operates from 950 mV to 1.05 V, supporting designs targeting this core supply range.
- Temperature Range Commercial-grade operation from 0 °C to 85 °C for standard ambient environments.
- Standards Compliance RoHS compliant, meeting common environmental and hazardous-substance requirements.
Typical Applications
- Complex Digital Processing Large logic capacity and embedded memory make this FPGA suitable for implementing extensive digital signal processing chains and custom datapaths.
- High-density I/O Systems 720 I/O pins enable aggregation and routing of numerous interfaces, useful for multi-channel or multi-board systems.
- Custom Logic Prototyping Ample CLBs and logic elements support hardware prototyping and validation of large-scale, application-specific logic blocks.
- Memory-intensive Functions On-chip RAM resources support buffering, LUT-based storage, and intermediate data staging within the programmable fabric.
Unique Advantages
- High Logic Capacity: 241,152 logic elements and 18,840 CLBs provide the headroom needed for large custom logic implementations.
- Significant On-chip Memory: Approximately 15.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
- Extensive Connectivity: 720 I/O pins allow flexible interfacing with multiple peripherals and high-channel-count designs.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.
- RoHS Compliance: Meets RoHS requirements for designs targeting environmental and regulatory considerations.
- Industry Manufacturer: Supplied by AMD, offering access to established documentation and product support resources.
Why Choose XC6VLX240T-1FFG1759C?
The XC6VLX240T-1FFG1759C positions itself as a high-capacity Virtex®-6 LXT FPGA option for projects that demand large logic arrays, substantial embedded memory, and high I/O counts within a commercial operating range. Its combination of 18,840 CLBs, 241,152 logic elements, and approximately 15.3 Mbits of on-chip RAM supports complex designs that require both compute fabric and internal storage.
This device is suited to design teams and procurement seeking a robust, high-density FPGA platform from a recognized manufacturer, with the package and electrical characteristics necessary for integration into surface-mount, board-level systems. The RoHS compliance and defined operating voltage and temperature ranges help ensure predictable behavior in standard commercial applications.
Request a quote or submit an inquiry to receive pricing, availability, and additional ordering information for the XC6VLX240T-1FFG1759C.

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