XC6VLX240T-1FF784I
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 15335424 241152 784-BBGA, FCBGA |
|---|---|
| Quantity | 56 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 18840 | Number of Logic Elements/Cells | 241152 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15335424 |
Overview of XC6VLX240T-1FF784I – Virtex®-6 LXT FPGA, 241,152 logic cells, 400 I/O
The XC6VLX240T-1FF784I is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-density logic fabric with 241,152 logic elements and approximately 15.3 Mbits of on-chip RAM for implementing complex digital functions.
Packaged in a 784‑FCBGA (29 × 29) surface-mount package with 400 I/O pins and an industrial operating range of −40 °C to 100 °C, this device supports designs that require significant logic capacity, substantial embedded memory, and extended temperature operation.
Key Features
- Logic Capacity 241,152 logic elements for implementing large-scale combinational and sequential logic.
- Embedded Memory Approximately 15.3 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
- I/O Density 400 user I/O pins to accommodate multiple interfaces and high pin-count designs.
- Power Supply Core voltage range from 0.950 V to 1.05 V to match system power rails and design requirements.
- Package & Mounting 784-FCBGA (29 × 29) package in a surface-mount form factor for board-space optimized integration.
- Industrial Grade Rated for industrial use with an operating temperature range of −40 °C to 100 °C for extended-environment deployment.
- Standards Compliance RoHS compliant to support lead-free assembly and regulatory requirements.
Unique Advantages
- High integration density: 241,152 logic elements and substantial on-chip RAM reduce the need for external components and simplify system architecture.
- Flexible I/O resources: 400 I/O pins enable support for multiple parallel interfaces and high-bandwidth connections without extensive external multiplexing.
- Industrial temperature capability: −40 °C to 100 °C rating provides confidence for deployments in demanding thermal environments.
- Compact, board-friendly package: The 784‑FCBGA (29 × 29) surface-mount package balances pin density and PCB footprint for complex designs.
- Regulatory readiness: RoHS compliance facilitates use in lead-free production environments.
- Tunable core power: Narrow core voltage range (0.950–1.05 V) supports predictable power delivery and thermal planning.
Why Choose XC6VLX240T-1FF784I?
The XC6VLX240T-1FF784I combines significant logic capacity, substantial embedded memory, and a high I/O count in a compact 784‑FCBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it a reliable choice for designs requiring robust operation across extended temperature ranges and lead‑free assembly.
This device is well suited for projects that demand large on-chip logic and memory resources with dense I/O capabilities, offering designers a scalable, integrated building block backed by AMD’s Virtex‑6 platform specifications.
Request a quote or submit a product inquiry to receive pricing and availability information for the XC6VLX240T-1FF784I.

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