XC6VLX240T-1FF784I

IC FPGA 400 I/O 784FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 15335424 241152 784-BBGA, FCBGA

Quantity 56 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package784-FCBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case784-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18840Number of Logic Elements/Cells241152
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15335424

Overview of XC6VLX240T-1FF784I – Virtex®-6 LXT FPGA, 241,152 logic cells, 400 I/O

The XC6VLX240T-1FF784I is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-density logic fabric with 241,152 logic elements and approximately 15.3 Mbits of on-chip RAM for implementing complex digital functions.

Packaged in a 784‑FCBGA (29 × 29) surface-mount package with 400 I/O pins and an industrial operating range of −40 °C to 100 °C, this device supports designs that require significant logic capacity, substantial embedded memory, and extended temperature operation.

Key Features

  • Logic Capacity  241,152 logic elements for implementing large-scale combinational and sequential logic.
  • Embedded Memory  Approximately 15.3 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
  • I/O Density  400 user I/O pins to accommodate multiple interfaces and high pin-count designs.
  • Power Supply  Core voltage range from 0.950 V to 1.05 V to match system power rails and design requirements.
  • Package & Mounting  784-FCBGA (29 × 29) package in a surface-mount form factor for board-space optimized integration.
  • Industrial Grade  Rated for industrial use with an operating temperature range of −40 °C to 100 °C for extended-environment deployment.
  • Standards Compliance  RoHS compliant to support lead-free assembly and regulatory requirements.

Unique Advantages

  • High integration density: 241,152 logic elements and substantial on-chip RAM reduce the need for external components and simplify system architecture.
  • Flexible I/O resources: 400 I/O pins enable support for multiple parallel interfaces and high-bandwidth connections without extensive external multiplexing.
  • Industrial temperature capability: −40 °C to 100 °C rating provides confidence for deployments in demanding thermal environments.
  • Compact, board-friendly package: The 784‑FCBGA (29 × 29) surface-mount package balances pin density and PCB footprint for complex designs.
  • Regulatory readiness: RoHS compliance facilitates use in lead-free production environments.
  • Tunable core power: Narrow core voltage range (0.950–1.05 V) supports predictable power delivery and thermal planning.

Why Choose XC6VLX240T-1FF784I?

The XC6VLX240T-1FF784I combines significant logic capacity, substantial embedded memory, and a high I/O count in a compact 784‑FCBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it a reliable choice for designs requiring robust operation across extended temperature ranges and lead‑free assembly.

This device is well suited for projects that demand large on-chip logic and memory resources with dense I/O capabilities, offering designers a scalable, integrated building block backed by AMD’s Virtex‑6 platform specifications.

Request a quote or submit a product inquiry to receive pricing and availability information for the XC6VLX240T-1FF784I.

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