XC6VLX240T-2FF1759C

The XC6VLX240T-2FF1759C is a Virtex®-6 LXT field programmable gate array (FPGA) from AMD provided in a 1759-FCBGA surface-mount package. It delivers a large on-chip resource set including 241,152 logic elements, approximately 15.33 Mbits of embedded memory, and 720 user I/Os to address complex, high-density digital designs.

Designed as a commercial-grade device (0 °C to 85 °C) with a core supply range of 950 mV to 1.05 V and RoHS compliance, this FPGA is suited to applications that require substantial logic capacity, significant embedded RAM, and a high I/O count in a compact BGA footprint.

Key Features

• Core Logic 241,152 logic elements enabling large-scale programmable logic implementations and complex custom digital functions.
• Embedded Memory Approximately 15.33 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory dependence.
• I/O Capacity 720 user I/O pins to support wide parallel interfaces, high channel counts, and mixed-signal routing requirements on the top-level PCB.
• Power Core voltage supply range of 950 mV to 1.05 V for compatible power-rail integration and system-level power planning.
• Package and Mounting 1759-BBGA / 1759-FCBGA package (42.5×42.5 mm) in a surface-mount form factor for high-density board designs.
• Temperature and Grade Commercial grade operation from 0 °C to 85 °C to match typical commercial and industrial-temperature board environments.
• Regulatory RoHS compliant, supporting lead-free manufacturing processes and regulatory requirements for many markets.

Typical Applications

• High-density logic systems — Use the large logic element count and embedded RAM to implement complex state machines, control logic, and custom accelerators.
• I/O-intensive interfaces — 720 I/Os support wide parallel buses, multiple interface instances, and high-channel-count connectivity.
• Embedded compute platforms — Combine on-chip RAM and logic resources to create customized data-paths and buffering for embedded processing tasks.

Unique Advantages

• High on-chip resource density: 241,152 logic elements and approximately 15.33 Mbits of embedded memory enable substantial functionality without immediate reliance on external components.
• Large I/O complement: 720 user I/Os provide flexibility for interfacing with multiple peripherals, sensors, or parallel data streams.
• Compact BGA package: The 1759-FCBGA (42.5×42.5 mm) footprint balances high pin count with a compact board area for space-constrained designs.
• Commercial-grade operation: Rated for 0 °C to 85 °C and RoHS compliant, suitable for standard commercial deployments.
• Predictable core power: A defined supply range of 950 mV to 1.05 V supports consistent power budgeting and supply design.

Why Choose XC6VLX240T-2FF1759C?

The XC6VLX240T-2FF1759C positions itself as a high-capacity Virtex-6 LXT FPGA for designs that require significant programmable logic, substantial embedded RAM, and a very high I/O count in a single surface-mount BGA package. Its commercial-grade temperature range and RoHS compliance make it appropriate for mainstream electronics and embedded applications where on-chip resources and I/O density are key selection criteria.

Manufactured by AMD and packaged in a 1759-FCBGA format, this device is a fit for engineers and procurement teams specifying large-scale FPGA resources with clear electrical and mechanical parameters for system integration and long-term deployment.

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