XC6VLX240T-2FF1759I

IC FPGA 720 I/O 1759FCBGA
Part Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 720 15335424 241152 1759-BBGA, FCBGA

Quantity 796 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1759-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1759-BBGA, FCBGANumber of I/O720Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18840Number of Logic Elements/Cells241152
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits15335424

Overview of XC6VLX240T-2FF1759I – Virtex®-6 LXT FPGA, 720 I/O, 1759-FCBGA

The XC6VLX240T-2FF1759I is a Virtex®-6 LXT field programmable gate array (FPGA) manufactured by AMD. The device delivers a large logic capacity and on-chip memory in a high-pin-count FCBGA package for compact system integration.

Key factory specifications include 241,152 logic elements, approximately 15.3 Mbits of embedded memory, 720 I/O, a 1759-FCBGA (42.5×42.5) surface-mount package, a supply range of 950 mV to 1.05 V, industrial grade classification, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

  • Core Logic 241,152 logic elements provide substantial on-chip logic resources for complex designs.
  • Embedded Memory Approximately 15.3 Mbits of on-chip RAM for buffering, state storage, and data-intensive functions.
  • I/O Capacity 720 user I/O pins support extensive peripheral and interface connectivity within a single device.
  • Power Operating supply range of 950 mV to 1.05 V for the device core.
  • Package & Mounting 1759-FCBGA package (42.5×42.5 mm) in a surface-mount form factor for compact PCB integration.
  • Environmental & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Unique Advantages

  • High logic density: 241,152 logic elements consolidate complex functions on a single FPGA, reducing the need for external logic components.
  • Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM supports large buffering and state-storage requirements without external memory.
  • Extensive I/O count: 720 I/O pins enable broad connectivity for multiple interfaces and peripherals from a single device.
  • Industrial temperature range: Rated from −40 °C to 100 °C to support deployment across a wide span of environmental conditions.
  • Compact, high-pin-count package: The 1759-FCBGA (42.5×42.5) surface-mount package balances high pin count with board-level integration needs.
  • Regulatory and manufacturing readiness: RoHS compliance and industrial grade classification support regulatory and procurement requirements.

Why Choose XC6VLX240T-2FF1759I?

The XC6VLX240T-2FF1759I positions a high-capacity Virtex®-6 LXT FPGA in an industrial-grade, surface-mount FCBGA package, combining large logic resources, significant embedded memory, and a high I/O count. These attributes make it suitable for designs that require substantial on-chip integration while adhering to industrial temperature and environmental standards.

Supported by AMD manufacturing and RoHS compliance, the device offers a balance of integration, scalability, and supply-chain readiness for engineering teams specifying industrial-grade FPGA solutions.

Request a quote or submit a quote for the XC6VLX240T-2FF1759I to obtain pricing and availability information.

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