XC6VLX240T-2FF1759I
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 720 15335424 241152 1759-BBGA, FCBGA |
|---|---|
| Quantity | 796 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1759-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1759-BBGA, FCBGA | Number of I/O | 720 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 18840 | Number of Logic Elements/Cells | 241152 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 15335424 |
Overview of XC6VLX240T-2FF1759I – Virtex®-6 LXT FPGA, 720 I/O, 1759-FCBGA
The XC6VLX240T-2FF1759I is a Virtex®-6 LXT field programmable gate array (FPGA) manufactured by AMD. The device delivers a large logic capacity and on-chip memory in a high-pin-count FCBGA package for compact system integration.
Key factory specifications include 241,152 logic elements, approximately 15.3 Mbits of embedded memory, 720 I/O, a 1759-FCBGA (42.5×42.5) surface-mount package, a supply range of 950 mV to 1.05 V, industrial grade classification, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.
Key Features
- Core Logic 241,152 logic elements provide substantial on-chip logic resources for complex designs.
- Embedded Memory Approximately 15.3 Mbits of on-chip RAM for buffering, state storage, and data-intensive functions.
- I/O Capacity 720 user I/O pins support extensive peripheral and interface connectivity within a single device.
- Power Operating supply range of 950 mV to 1.05 V for the device core.
- Package & Mounting 1759-FCBGA package (42.5×42.5 mm) in a surface-mount form factor for compact PCB integration.
- Environmental & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
Unique Advantages
- High logic density: 241,152 logic elements consolidate complex functions on a single FPGA, reducing the need for external logic components.
- Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM supports large buffering and state-storage requirements without external memory.
- Extensive I/O count: 720 I/O pins enable broad connectivity for multiple interfaces and peripherals from a single device.
- Industrial temperature range: Rated from −40 °C to 100 °C to support deployment across a wide span of environmental conditions.
- Compact, high-pin-count package: The 1759-FCBGA (42.5×42.5) surface-mount package balances high pin count with board-level integration needs.
- Regulatory and manufacturing readiness: RoHS compliance and industrial grade classification support regulatory and procurement requirements.
Why Choose XC6VLX240T-2FF1759I?
The XC6VLX240T-2FF1759I positions a high-capacity Virtex®-6 LXT FPGA in an industrial-grade, surface-mount FCBGA package, combining large logic resources, significant embedded memory, and a high I/O count. These attributes make it suitable for designs that require substantial on-chip integration while adhering to industrial temperature and environmental standards.
Supported by AMD manufacturing and RoHS compliance, the device offers a balance of integration, scalability, and supply-chain readiness for engineering teams specifying industrial-grade FPGA solutions.
Request a quote or submit a quote for the XC6VLX240T-2FF1759I to obtain pricing and availability information.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








