XC6VLX240T-2FFG1759C

The XC6VLX240T-2FFG1759C is a Virtex®-6 LXT field programmable gate array (FPGA) in a 1759-ball FCBGA package designed for surface-mount applications. It delivers a high logic element count, substantial embedded memory, and a large number of I/O pins for complex digital designs in commercial-temperature environments.

Key Features

• Core Logic Capacity 241,152 logic elements provide a high-density programmable fabric for implementing complex custom digital functions.
• Embedded Memory Approximately 15.3 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic structures.
• I/O Count 720 user I/O pins to support wide external interfacing and parallel data paths.
• Package and Mounting 1759-FCBGA (42.5 × 42.5 mm) package, surface-mount mounting type for board-level integration.
• Power Core supply voltage range of 0.95 V to 1.05 V to match systems designed for this nominal core voltage.
• Operating Conditions Commercial-grade operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• Environmental Compliance RoHS-compliant construction for regulatory and supply-chain requirements.

Unique Advantages

• High logic density: 241,152 logic elements enable integration of complex functions and consolidation of multiple components into a single FPGA.
• Substantial embedded memory: Approximately 15.3 Mbits of on-chip RAM reduces dependence on external memory for many buffering and queuing needs.
• Extensive I/O capability: 720 I/O pins accommodate broad peripheral connectivity and high-throughput interfaces.
• Compact FCBGA package: 1759-ball FCBGA (42.5 × 42.5 mm) provides a dense, surface-mount solution for space-constrained PCBs.
• Tight core-voltage specification: 0.95–1.05 V supply range aids predictable power design and system integration.
• Commercial temperature and RoHS-compliant: Designed for commercial-temperature deployments while meeting RoHS requirements for compliance.

Why Choose XC6VLX240T-2FFG1759C?

The XC6VLX240T-2FFG1759C combines high logic capacity, significant embedded memory, and a large I/O complement in a single 1759-FCBGA surface-mount package. Its specifications make it well suited for commercial designs that require a high-density programmable fabric and extensive interfacing capability while operating within a 0 °C to 85 °C range.

With RoHS compliance and a defined core voltage window, this FPGA supports projects that prioritize compact board-level integration, predictable power rails, and on-chip memory resources to reduce external BOM complexity.

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