XC6VLX240T-2FFG784C

The XC6VLX240T-2FFG784C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) from AMD. It delivers a high-density programmable fabric with 241,152 logic cells and 18,840 CLBs to implement complex digital logic and system-level functions on a single device.

With approximately 15.3 Mbits of embedded memory, 400 I/O pins, a 784-ball FCBGA (29 × 29 mm) package, and a commercial operating range, this device targets high‑capacity FPGA designs that require substantial on-chip resources and flexible I/O in a compact surface-mount package.

Key Features

• Core Logic  18,840 CLBs providing a total of 241,152 logic cells for large, multi-function designs.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM to support data buffering, packet processing, and memory‑intensive algorithms.
• I/O Capacity  400 I/O pins to enable wide parallel interfaces and multiple protocol connectivity.
• Package  784-ball BGA, FCBGA (29 × 29 mm) surface-mount package for board-level integration in space-constrained designs.
• Power  Core voltage supply in the range of 0.95 V to 1.05 V to match platform power requirements.
• Operating Range  Commercial temperature grade rated from 0 °C to 85 °C.
• Compliance  RoHS-compliant to meet common environmental directives for electronic assemblies.

Typical Applications

• High-density digital systems  Large logic capacity and CLB count enable implementation of complex control and processing functions on a single device.
• Memory‑intensive designs  Approximately 15.3 Mbits of embedded RAM supports buffering, queuing, and on-chip data storage without external memory in some designs.
• Multi‑interface platforms  400 I/O pins accommodate parallel buses, peripheral interfaces, and multi‑lane connectivity for system integration.

Unique Advantages

• Highly integrated logic resources: 241,152 logic cells and 18,840 CLBs reduce the need for multiple FPGAs or external glue logic.
• Substantial on‑chip memory: Approximately 15.3 Mbits of embedded RAM supports data‑centric functions directly in the FPGA fabric.
• Wide I/O count: 400 I/O pins provide flexibility to connect numerous peripherals and parallel interfaces without external multiplexing.
• Compact, manufacturable package: 784‑ball FCBGA (29 × 29 mm) surface-mount package simplifies PCB layout for high-density boards.
• Commercial temperature and RoHS compliance: Operates across 0 °C to 85 °C and meets RoHS requirements for regulatory conformity.
• Controlled core voltage: 0.95 V to 1.05 V supply range supports predictable power planning in system design.

Why Choose XC6VLX240T-2FFG784C?

The XC6VLX240T-2FFG784C combines high logic density, significant embedded memory, and a large I/O count in a compact 784‑ball FCBGA package, making it suitable for designs that require consolidated digital logic and on-chip storage. As a commercial‑grade Virtex®-6 LXT device from AMD, it provides a clear specification set for engineers and procurement teams seeking a high-capacity FPGA solution backed by manufacturer documentation.

This device is ideal for development teams and OEMs implementing complex digital systems that benefit from integrated logic, extensive I/O, and substantial on‑chip RAM while operating within commercial temperature limits.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC6VLX240T-2FFG784C. Detailed technical documentation is available from the manufacturer to support evaluation and system integration.