XC6VLX240T-3FFG784C

The XC6VLX240T-3FFG784C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD, provided in a 784-ball FCBGA package (784-BBGA, supplier package 784-FCBGA (29x29)). It delivers high logic capacity and substantial on-chip RAM in a commercial-grade, surface-mount FPGA targeted at designs that require large-scale programmable logic and numerous I/O connections.

With 241,152 logic elements, approximately 15.3 Mbits of embedded memory and 400 user I/O pins, this device supports complex, high-density logic implementations while operating across a 0 °C to 85 °C commercial temperature range and a core supply range of 950 mV to 1.05 V.

Key Features

• Logic Capacity  241,152 logic elements for large-scale programmable logic and complex design partitioning.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• I/O Density  400 user I/O pins to accommodate wide parallel interfaces, multi‑lane buses, and diverse peripheral connections.
• Package and Mounting  784-BBGA FCBGA package (supplier package 784-FCBGA (29x29)), surface-mount for board-level integration.
• Power Supply  Core voltage range of 950 mV to 1.05 V for compatibility with standard FPGA power rails.
• Commercial Grade and Temperature  Rated for commercial operation from 0 °C to 85 °C.
• RoHS Compliant  Meets RoHS environmental requirements for reduced hazardous substances.

Typical Applications

• High-density logic systems  Implement complex signal processing, protocol handling, or custom compute pipelines requiring large logic and memory resources.
• Communications and networking  Support wide parallel I/O and on-chip memory for buffering and protocol implementation in board-level network equipment.
• Embedded system integration  Provide programmable hardware resources for glue logic, data aggregation, and custom interfaces in commercial embedded platforms.

Unique Advantages

• Large programmable fabric: 241,152 logic elements enable partitioning of complex designs and integration of multiple functions into a single FPGA.
• Substantial embedded memory: Approximately 15.3 Mbits of on-chip RAM reduces external memory dependency and simplifies board-level design.
• High I/O count: 400 user I/Os provide flexibility for parallel data paths, multi-channel interfaces, and extensive peripheral connectivity.
• Compact BGA packaging: 784-ball FCBGA footprint supports high-density PCB integration while maintaining a surface-mount assembly flow.
• Commercial temperature rating: Designed for standard commercial environments (0 °C to 85 °C), suitable for a wide range of non-industrial applications.
• Regulatory compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose XC6VLX240T-3FFG784C?

The XC6VLX240T-3FFG784C combines high logic capacity, significant on-chip RAM, and a large I/O complement in a commercial-grade Virtex®-6 LXT FPGA package. It is well suited to designs that demand dense programmable logic and wide interface options while maintaining standard commercial operating conditions and a compact BGA footprint.

This device is appropriate for design teams and OEMs building complex board-level systems that benefit from integrating multiple hardware functions into a single programmable device, and for projects that require RoHS compliance and AMD-supported Virtex-6 documentation.

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