XC6VLX240T-L1FFG1156I

The XC6VLX240T-L1FFG1156I is a Virtex-6 LXT field programmable gate array (FPGA) in a 1156-FCBGA package. It delivers high logic capacity and on-chip memory with a large I/O count, aimed at designs that require dense programmable logic and extensive interfacing.

With industrial-grade temperature range and a low-voltage supply window, this device is suited for systems that need robust operation across a wide thermal range while providing significant integration of logic, memory, and I/O resources.

Key Features

• Logic Capacity  Provides 241,152 logic elements to implement large, complex digital designs and custom processing pipelines.
• Embedded Memory  Approximately 15.3 Mbits of on-chip RAM to support buffering, lookup tables, and data storage close to logic.
• I/O Count  Up to 600 user I/O pins, enabling wide parallel data paths and extensive external connectivity.
• Package & Mounting  1156-BBGA / 1156-FCBGA (35×35) package in a surface-mount form factor for high-density board integration.
• Power  Operates from a nominal supply window of 910 mV to 970 mV, enabling designs optimized around this core voltage range.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded memory for custom signal processing, packet processing, or compute-acceleration tasks.
• I/O-intensive systems  With 600 I/O pins, the device is suited to applications requiring broad parallel interfaces or multiple high-speed peripheral connections.
• Industrial control and automation  Industrial-grade temperature range and robust packaging support deployment in control systems and factory automation equipment.
• Embedded memory–centric designs  Approximately 15.3 Mbits of on-chip RAM enables local buffering and state storage for real-time and embedded applications.

Unique Advantages

• High logic density: 241,152 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 15.3 Mbits of embedded RAM helps minimize external memory dependency and improves data-path latency.
• Extensive I/O resources: 600 I/O pins allow flexible interfacing to sensors, transceivers, and external peripherals without intermediate multiplexing.
• Industrial-grade operation: Rated from −40 °C to 100 °C to support deployment in harsher thermal environments.
• Compact, surface-mount package: 1156-FCBGA (35×35) enables high-density PCB layouts while supporting thermal and mechanical requirements of complex systems.
• RoHS compliant: Meets lead-free and environmental requirements for modern electronic assemblies.

Why Choose XC6VLX240T-L1FFG1156I?

The XC6VLX240T-L1FFG1156I balances large programmable logic capacity, significant on-chip memory, and a high I/O count within an industrial-grade FPGA package. It is well suited for engineers designing complex digital systems that require consolidation of functions, substantial local buffering, and broad external connectivity.

Choosing this FPGA supports scalable, robust designs where thermal tolerance, integration density, and a clear power-supply window are important considerations. The combination of logic elements, embedded RAM, and packaging makes it appropriate for demanding embedded and industrial applications.

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