XC6VLX365T-1FFG1759C

The XC6VLX365T-1FFG1759C is a Virtex-6 LXT Field Programmable Gate Array supplied in a 1759‑FCBGA package. It provides a high on-chip logic capacity and embedded memory, along with a large I/O count and a low-voltage core supply, making it suitable for designs that require substantial logic density and memory integration.

Key Features

• Core Architecture Virtex-6 LXT FPGA architecture in the XC6VLX365T configuration, delivered in a 1759‑BBGA (1759‑FCBGA) package.
• Logic Capacity 364,032 logic elements to support large, complex logic implementations.
• Embedded Memory Approximately 15.3 Mbits of on-chip RAM for data buffering, state storage, and local memory structures.
• I/O Density 720 user I/O pins to support high-channel-count interfaces and parallel connectivity.
• Power Core voltage supply range of 0.95 V to 1.05 V for the device core.
• Package and Mounting 1759‑FCBGA package (42.5 × 42.5 mm) designed for surface-mount PCB assembly.
• Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• High-density logic designs — For systems that require up to 364,032 logic elements to implement complex custom logic and control functions.
• Memory-intensive processing — Use the approximately 15.3 Mbits of embedded memory for buffering, lookup tables, and local data storage in real-time processing tasks.
• High-channel I/O systems — The 720 I/O pins enable designs with many parallel interfaces, multi-channel data acquisition, or extensive peripheral connectivity.
• Compact PCB implementations — The 1759‑FCBGA (42.5 × 42.5 mm) surface-mount package supports dense board layouts where board space and I/O density are critical.

Unique Advantages

• Substantial logic capacity: 364,032 logic elements reduce the need to partition designs across multiple devices.
• Significant on-chip memory: Approximately 15.3 Mbits of embedded RAM supports local data handling and reduces external memory dependence.
• High I/O count: 720 I/O pins enable broad external connectivity for complex systems and multi-channel interfaces.
• Compact FCBGA package: 1759‑FCBGA (42.5 × 42.5 mm) enables high-density PCB integration while maintaining robust pin count.
• Low-voltage core operation: 0.95 V–1.05 V core supply supports designs targeting modern low-voltage FPGA cores.
• RoHS compliant: Meets RoHS requirements for environmental and regulatory considerations.

Why Choose XC6VLX365T-1FFG1759C?

The XC6VLX365T-1FFG1759C positions itself as a high-capacity Virtex-6 LXT FPGA option that combines extensive logic resources, meaningful on-chip memory, and a high I/O count in a single commercial-grade FCBGA package. This balance of resources is well suited to engineering teams implementing large, integrated digital systems that benefit from consolidated logic and memory.

Customers designing scalable, compute- and I/O-intensive applications will find the device valuable for reducing external component count, simplifying board-level design, and supporting complex functionality within a single FPGA footprint.

Request a quote or contact sales for availability and pricing to evaluate the XC6VLX365T-1FFG1759C for your next design.