XC6VLX365T-2FFG1156C

The XC6VLX365T-2FFG1156C is a Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD. It provides high logic density with 364,032 logic elements, approximately 15.34 Mbits of embedded memory, and 600 user I/O pins in a 1156-FCBGA (35×35) surface-mount package.

Designed for commercial-temperature applications, the device operates from 0 °C to 85 °C and requires a core supply in the 0.95 V to 1.05 V range, making it suitable for designs that need large on-chip resources and substantial I/O capacity.

Key Features

• Core Capacity 364,032 logic elements provide a high level of programmable logic for complex digital designs.
• Embedded Memory Approximately 15.34 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O Resources 600 user I/O pins enable extensive external interfacing and high pin-count connectivity.
• Package & Mounting 1156-BBGA / 1156-FCBGA (35×35) package designed for surface-mount assembly to meet compact board layout requirements.
• Power Core voltage supply range of 0.95 V to 1.05 V to match specified power rails.
• Operating Grade & Temperature Commercial grade device rated for operation from 0 °C to 85 °C.
• Standards Compliance RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing Large logic capacity supports complex FPGA-based processing, custom accelerators, and dense digital functions.
• I/O-rich system interfaces 600 I/O pins accommodate multiple high-pin-count interfaces and broad external connectivity on a single device.
• On-chip buffering and memory tasks Approximately 15.34 Mbits of embedded RAM enable local buffering, data staging, and intermediate storage close to logic.

Unique Advantages

• High logic density: 364,032 logic elements enable consolidation of large designs onto a single FPGA, reducing component count.
• Generous embedded memory: Approximately 15.34 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O capacity: 600 user I/Os provide flexibility to connect multiple peripherals and interfaces without multiplexing compromises.
• Compact, manufacturable package: 1156-FCBGA (35×35) surface-mount package supports dense PCB layouts and automated assembly processes.
• Commercial temperature rating: Specified 0 °C to 85 °C operating range aligns with standard commercial-design requirements.
• Regulatory compliance: RoHS-compliant construction supports common environmental and procurement standards.

Why Choose XC6VLX365T-2FFG1156C?

The XC6VLX365T-2FFG1156C balances sizable programmable logic, substantial embedded memory, and broad I/O in a single, surface-mount 1156-FCBGA package. Its combination of 364,032 logic elements, approximately 15.34 Mbits of on-chip RAM, and 600 I/O pins makes it appropriate for designers targeting dense logic implementations with extensive external connectivity within commercial-temperature applications.

As an AMD-manufactured Virtex®-6 LXT device, it provides a high-resource FPGA option for projects that require consolidation of functions, reduced board-level complexity, and a compact package footprint.

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