XC6VLX365T-L1FF1156I

The XC6VLX365T-L1FF1156I is a Virtex®-6 LXT field programmable gate array (FPGA) IC from AMD, offered in a 1156-ball FCBGA package. It provides a high logic capacity with extensive I/O and substantial on-chip RAM, suited to designs that require dense logic integration and large I/O connectivity within an industrial temperature range.

Key Features

• Logic Capacity — 364,032 logic elements to implement large-scale digital designs and complex combinational/sequential logic.
• Configurable Logic Blocks — High block count to map extensive logic functions and parallel datapaths.
• Embedded Memory — Approximately 15.3 Mbits of on-chip RAM (15,335,424 bits) for buffering, FIFOs, and local data storage.
• High I/O Count — 600 user I/O pins to support dense external connectivity and multiple peripheral interfaces.
• Power Range — Core voltage supply specified from 910 mV to 970 mV for core power planning and regulator selection.
• Package & Mounting — 1156-FCBGA (35×35) package in a surface-mount format for compact board-level integration.
• Industrial Temperature Rating — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards Compliance — RoHS compliant, supporting lead-free assembly and regulatory requirements for many production environments.

Typical Applications

• Communications Equipment — Use the high logic density and 600 I/O to implement packet processing, protocol bridging, and interface aggregation.
• Industrial Automation — Leverage the industrial temperature range and extensive I/O for control, motor drive interfaces, and sensor aggregation in factory systems.
• Test & Measurement — Implement custom data acquisition, signal conditioning, and timing logic using the device’s large logic and memory resources.
• Prototyping and System Integration — Deploy as a high-capacity development platform for validating complex digital subsystems and multi-interface designs.

Unique Advantages

• High Logic Density: 364,032 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Generous On-Chip Memory: Approximately 15.3 Mbits of RAM provide local data storage to minimize external memory dependencies and improve throughput.
• Extensive I/O: 600 I/O pins support a wide range of external interfaces and parallel connections, simplifying routing for multi-channel designs.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• Compact Package: 1156-FCBGA (35×35) surface-mount package enables dense board integration while maintaining thermal and mechanical robustness.
• Regulatory Compatibility: RoHS compliance aids in meeting lead-free assembly and environmental requirements.

Why Choose XC6VLX365T-L1FF1156I?

The XC6VLX365T-L1FF1156I combines substantial logic capacity, sizable on-chip RAM, and a large I/O complement in a single industrial-grade FCBGA package. This balance of integration and connectivity is well-suited to engineers and system designers building complex digital subsystems that require significant local resources and robust operation across a wide temperature range.

Choosing this Virtex®-6 LXT FPGA supports consolidation of multiple functions onto a single device, simplifies board-level design with abundant I/O, and provides on-chip memory to reduce dependence on external components—delivering a scalable, reliable platform for industrial and high-density applications.

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