XC6VLX195T-3FF784C
| Part Description |
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 12681216 199680 784-BBGA, FCBGA |
|---|---|
| Quantity | 342 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 784-FCBGA (29x29) | Grade | Commercial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 784-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15600 | Number of Logic Elements/Cells | 199680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12681216 |
Overview of XC6VLX195T-3FF784C – Virtex®-6 LXT Field Programmable Gate Array (FPGA), 784-FCBGA
The XC6VLX195T-3FF784C is a Virtex®-6 LXT field programmable gate array (FPGA) supplied in a 784‑ball FCBGA (29×29 mm) package. It delivers a large programmable fabric with 199,680 logic elements, approximately 12.68 Mbits of embedded memory, and 400 I/O pins, making it suitable for designs that require significant on-chip logic and memory resources within a surface-mount, commercial-grade device.
Operating across a core supply range of 0.95 V to 1.05 V and an ambient temperature window of −40°C to 100°C, the device provides a balance of integration and system-level flexibility while meeting RoHS compliance requirements.
Key Features
- Programmable Logic Capacity Approximately 199,680 logic elements provide extensive resources for implementing complex digital designs and custom logic functions.
- Embedded Memory Approximately 12.68 Mbits of on-chip RAM supports buffering, data storage, and state retention for implemented logic blocks.
- I/O and Package 400 user I/O pins in a 784‑ball FCBGA (29×29) surface-mount package enable broad connectivity options for high-density system interfaces.
- Power Supply Core voltage support from 0.95 V to 1.05 V aligns with the device’s specified operating requirements.
- Operating Range Commercial-grade operation across −40°C to 100°C for general-purpose embedded and electronic applications.
- Regulatory Compliance RoHS compliant to support environmentally responsible manufacturing and assembly practices.
Typical Applications
- Custom digital processing Implement wide-ranging digital functions and prototypes using the device’s large logic element and embedded memory capacity.
- High-density I/O interfacing 400 I/O pins support integration with multiple peripherals and complex board-level interconnects.
- System consolidation Combine multiple discrete functions into a single FPGA to reduce board-level component count and simplify system architecture.
Unique Advantages
- Large logic resource pool: 199,680 logic elements enable substantial on-chip logic implementation without immediate need for additional programmable devices.
- Significant embedded memory: Approximately 12.68 Mbits of on-chip RAM supports data buffering, FIFO structures, and memory-intensive logic tasks.
- Ample I/O count: 400 I/O pins allow flexible interfacing to sensors, peripherals, and external memory or logic devices.
- Compact surface-mount package: 784‑ball FCBGA (29×29) supports high-density board layouts while maintaining surface-mount assembly compatibility.
- Commercial-grade temperature range: Operation from −40°C to 100°C addresses a wide set of general-purpose electronic deployments.
- RoHS compliant: Designed to meet environmental regulations for lead-free assembly processes.
Why Choose XC6VLX195T-3FF784C?
The XC6VLX195T-3FF784C positions itself as a high-capacity Virtex‑6 LXT FPGA option when designs demand extensive on-chip logic, embedded memory, and substantial I/O in a compact surface-mount package. Its combination of 199,680 logic elements, approximately 12.68 Mbits of embedded RAM, and 400 I/Os provides designers with a flexible platform for consolidating functions, implementing custom digital architectures, and addressing complex interfacing needs.
As a commercial-grade, RoHS-compliant device with defined voltage and temperature ranges, this FPGA is appropriate for a broad set of electronic applications that require scalable programmable logic, strong memory resources, and high I/O density supported by a standard FCBGA footprint.
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