XC6VHX380T-2FFG1154I

The XC6VHX380T-2FFG1154I is a Virtex®-6 HXT field programmable gate array (FPGA) from AMD designed for high-density, reconfigurable digital logic. It combines a large logic fabric, substantial on-chip memory, and a high I/O count in a compact 1156-FCBGA package for industrial applications.

With 382,464 logic elements and approximately 28.3 Mbits of embedded memory, this device is targeted at designs that require significant logic capacity, embedded RAM, and robust operation across an industrial temperature range.

Key Features

• Core Logic  382,464 logic elements provide large-scale, user-programmable digital logic capacity for complex custom functions.
• Configurable Logic Blocks  29,880 CLBs enable structured implementation of combinational and sequential logic designs.
• Embedded Memory  Approximately 28.3 Mbits of on-chip RAM supports buffering, lookup tables, and intermediate data storage without external memory.
• I/O Capability  320 available I/O pins allow extensive board-level interfacing and multiple external connections.
• Power  Core supply range from 0.95 V to 1.05 V supports designs targeting this nominal voltage window.
• Package  1156-FCBGA (35×35 mm) package provides a compact, high-density footprint for surface-mount board integration.
• Temperature Range  Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environmental conditions.
• Compliance  RoHS-compliant construction meets standard environmental directives for lead-free assembly.

Typical Applications

• Industrial Control and Automation  Implement complex control logic and local data buffering using high logic capacity and embedded memory while meeting industrial temperature requirements.
• High‑Density Prototyping and System Integration  Large logic resources and a 1156-FCBGA package support compact, board-level integration for system prototypes and dense designs.
• Signal Processing and Buffering  Approximately 28.3 Mbits of on-chip RAM enables intermediate storage and real-time data handling within signal processing pipelines.
• I/O‑Intensive Designs  320 I/O pins provide the connectivity needed for multi-channel interfaces and extensive peripheral integration.

Unique Advantages

• High Logic Capacity: 382,464 logic elements enable implementation of large, complex custom digital functions without partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 28.3 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage, simplifying BOM and board layout.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C for reliable operation in harsh or variable environments common to industrial deployments.
• High I/O Density: 320 I/O pins allow flexible interfacing to sensors, actuators, or external logic, minimizing the need for additional I/O expanders.
• Compact High‑Density Package: 1156-FCBGA (35×35) delivers a dense footprint for space-constrained boards while supporting high routing density.
• Vendor Backing: Manufactured by AMD, offering consistency in sourcing and part identification for procurement and long-term projects.

Why Choose XC6VHX380T-2FFG1154I?

The XC6VHX380T-2FFG1154I positions itself as a high-capacity, industrial-grade FPGA that balances large programmable logic resources with substantial on-chip memory and a high I/O count. Its combination of 382,464 logic elements, approximately 28.3 Mbits of embedded RAM, and a 1156-FCBGA package makes it suitable for designs that require dense integration and robust operation across a wide temperature range.

This device is suited for engineering teams developing complex industrial systems, high-density prototypes, and I/O-rich applications that need scalable programmable logic and integrated memory in a compact, surface-mount package.

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