XC6VHX380T-2FF1923CES9945
| Part Description |
Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC 720 28311552 382464 1924-BBGA, FCBGA |
|---|---|
| Quantity | 525 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1924-FCBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 720 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 29880 | Number of Logic Elements/Cells | 382464 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28311552 |
Overview of XC6VHX380T-2FF1923CES9945 – Virtex®-6 HXT FPGA, approximately 382,464 logic elements, 720 I/O
The XC6VHX380T-2FF1923CES9945 is a Virtex®-6 HXT field programmable gate array (FPGA) IC from AMD. It delivers high logic capacity and substantial on-chip memory in a surface-mount FCBGA package.
Key hardware characteristics include approximately 382,464 logic elements, approximately 28.3 Mbits of embedded memory, and 720 I/O pins. The device is supplied with a core voltage range of 0.95 V to 1.05 V and is specified for commercial operating temperatures from 0 °C to 85 °C.
Key Features
- Core and Logic Capacity Approximately 382,464 logic elements provide dense programmable logic resources for complex designs.
- Embedded Memory Approximately 28.3 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
- I/O Count 720 available I/O pins to support extensive interfacing and parallel connectivity.
- Package and Mounting 1924-FCBGA package (45 × 45 mm) in a 1924-BBGA footprint; designed for surface-mount assembly.
- Power Supply Core voltage specified from 0.95 V to 1.05 V to match system power rails and regulator designs.
- Temperature and Grade Commercial-grade device with an operating range of 0 °C to 85 °C.
- Environmental Compliance RoHS-compliant design for regulatory and assembly considerations.
Unique Advantages
- High logic density: Large logic element count enables consolidation of complex functions into a single FPGA, reducing system-level component count.
- Substantial on-chip memory: Approximately 28.3 Mbits of embedded RAM supports data buffering and local storage without external memory.
- Extensive I/O capability: 720 I/O pins allow broad interfacing options for parallel buses, sensors, and external peripherals.
- Compact FCBGA package: 1924-FCBGA (45×45 mm) provides a high-pin-count solution in a standardized surface-mount form factor.
- Defined voltage and thermal envelope: Narrow core supply range (0.95–1.05 V) and commercial temperature rating simplify power and thermal planning.
- RoHS compliant: Facilitates assembly and regulatory compliance in commercial product builds.
Why Choose XC6VHX380T-2FF1923CES9945?
The XC6VHX380T-2FF1923CES9945 positions itself as a high-capacity Virtex-6 HXT FPGA tailored for designs requiring significant programmable logic, on-chip memory, and a large number of I/O signals within a surface-mount FCBGA package. Its combination of approximately 382,464 logic elements and approximately 28.3 Mbits of embedded RAM supports complex, memory-intensive functions while minimizing external components.
As a commercial-grade, RoHS-compliant FPGA manufactured by AMD, the device is appropriate for product designs that prioritize integration density, predictable power requirements (0.95–1.05 V core), and a defined operating temperature range (0 °C to 85 °C).
Request a quote or submit a purchase inquiry to obtain pricing, availability, and ordering information for the XC6VHX380T-2FF1923CES9945.

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