XC6VHX380T-2FF1923CES9945

IC FPGA 720 I/O 1924FCBGA
Part Description

Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC 720 28311552 382464 1924-BBGA, FCBGA

Quantity 525 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1924-FCBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1924-BBGA, FCBGANumber of I/O720Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs29880Number of Logic Elements/Cells382464
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28311552

Overview of XC6VHX380T-2FF1923CES9945 – Virtex®-6 HXT FPGA, approximately 382,464 logic elements, 720 I/O

The XC6VHX380T-2FF1923CES9945 is a Virtex®-6 HXT field programmable gate array (FPGA) IC from AMD. It delivers high logic capacity and substantial on-chip memory in a surface-mount FCBGA package.

Key hardware characteristics include approximately 382,464 logic elements, approximately 28.3 Mbits of embedded memory, and 720 I/O pins. The device is supplied with a core voltage range of 0.95 V to 1.05 V and is specified for commercial operating temperatures from 0 °C to 85 °C.

Key Features

  • Core and Logic Capacity  Approximately 382,464 logic elements provide dense programmable logic resources for complex designs.
  • Embedded Memory  Approximately 28.3 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
  • I/O Count  720 available I/O pins to support extensive interfacing and parallel connectivity.
  • Package and Mounting  1924-FCBGA package (45 × 45 mm) in a 1924-BBGA footprint; designed for surface-mount assembly.
  • Power Supply  Core voltage specified from 0.95 V to 1.05 V to match system power rails and regulator designs.
  • Temperature and Grade  Commercial-grade device with an operating range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS-compliant design for regulatory and assembly considerations.

Unique Advantages

  • High logic density: Large logic element count enables consolidation of complex functions into a single FPGA, reducing system-level component count.
  • Substantial on-chip memory: Approximately 28.3 Mbits of embedded RAM supports data buffering and local storage without external memory.
  • Extensive I/O capability: 720 I/O pins allow broad interfacing options for parallel buses, sensors, and external peripherals.
  • Compact FCBGA package: 1924-FCBGA (45×45 mm) provides a high-pin-count solution in a standardized surface-mount form factor.
  • Defined voltage and thermal envelope: Narrow core supply range (0.95–1.05 V) and commercial temperature rating simplify power and thermal planning.
  • RoHS compliant: Facilitates assembly and regulatory compliance in commercial product builds.

Why Choose XC6VHX380T-2FF1923CES9945?

The XC6VHX380T-2FF1923CES9945 positions itself as a high-capacity Virtex-6 HXT FPGA tailored for designs requiring significant programmable logic, on-chip memory, and a large number of I/O signals within a surface-mount FCBGA package. Its combination of approximately 382,464 logic elements and approximately 28.3 Mbits of embedded RAM supports complex, memory-intensive functions while minimizing external components.

As a commercial-grade, RoHS-compliant FPGA manufactured by AMD, the device is appropriate for product designs that prioritize integration density, predictable power requirements (0.95–1.05 V core), and a defined operating temperature range (0 °C to 85 °C).

Request a quote or submit a purchase inquiry to obtain pricing, availability, and ordering information for the XC6VHX380T-2FF1923CES9945.

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