XC6VHX380T-1FFG1923C

IC FPGA 720 I/O 1924FCBGA
Part Description

Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC 720 28311552 382464 1924-BBGA, FCBGA

Quantity 1,486 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package1924-FCBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1924-BBGA, FCBGANumber of I/O720Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs29880Number of Logic Elements/Cells382464
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28311552

Overview of XC6VHX380T-1FFG1923C – Virtex®-6 HXT FPGA, 1924-FCBGA

The XC6VHX380T-1FFG1923C is a Virtex-6 HXT field programmable gate array (FPGA) from AMD. It combines high logic capacity with substantial on-chip memory and a large I/O complement for complex, high-density programmable designs.

This surface-mount FCBGA device features 382,464 logic cells and 29,880 logic elements, approximately 28.3 Mbits of embedded memory, 720 I/O, and a 1924-ball FCBGA (45 × 45 mm) package. The device operates from a core supply of 0.95 V to 1.05 V and is rated for commercial temperature operation from 0 °C to 85 °C.

Key Features

  • Core Logic  Provides 382,464 logic cells and 29,880 logic elements to implement large-scale programmable logic and control structures.
  • Embedded Memory  Approximately 28.3 Mbits of on-chip RAM to support data buffering, lookup tables, and local storage for complex designs.
  • I/O Density  720 I/O pins support extensive external connectivity and parallel interfacing requirements.
  • Package & Mounting  1924-ball FCBGA package (45 × 45 mm) in a 1924-BBGA form factor designed for surface-mount assembly.
  • Power  Core supply range specified at 0.95 V to 1.05 V for device operation.
  • Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High logic capacity: 382,464 logic cells support designs with substantial combinational and sequential logic requirements.
  • Significant on-chip memory: Approximately 28.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • Extensive I/O count: 720 I/O pins enable broad peripheral and interface integration without immediate need for external multiplexing.
  • Dense, surface-mount package: 1924-ball FCBGA (45 × 45 mm) allows a compact board footprint while providing a high pin count.
  • Commercial operating range: Specified 0 °C to 85 °C temperature rating aligns with standard commercial embedded applications.
  • RoHS compliant: Meets lead-free and restricted-substance requirements for commercial products.

Why Choose XC6VHX380T-1FFG1923C?

The XC6VHX380T-1FFG1923C positions itself as a high-capacity, commercially rated FPGA suitable for complex, high-density designs that require large logic resources, ample on-chip memory, and a high I/O count. Its 1924-ball FCBGA package provides a dense integration option for compact system boards.

Designers and procurement teams seeking a commercially graded Virtex-6 HXT device with verifiable logic, memory, I/O, and package specifications will find this part appropriate for scalable, high-performance programmable logic implementations backed by AMD's product family documentation.

Request a quote or submit a quote for the XC6VHX380T-1FFG1923C to receive pricing and availability information specific to your project needs.

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