XC6VHX380T-1FFG1923C
| Part Description |
Virtex®-6 HXT Field Programmable Gate Array (FPGA) IC 720 28311552 382464 1924-BBGA, FCBGA |
|---|---|
| Quantity | 1,486 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1924-FCBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 720 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 29880 | Number of Logic Elements/Cells | 382464 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28311552 |
Overview of XC6VHX380T-1FFG1923C – Virtex®-6 HXT FPGA, 1924-FCBGA
The XC6VHX380T-1FFG1923C is a Virtex-6 HXT field programmable gate array (FPGA) from AMD. It combines high logic capacity with substantial on-chip memory and a large I/O complement for complex, high-density programmable designs.
This surface-mount FCBGA device features 382,464 logic cells and 29,880 logic elements, approximately 28.3 Mbits of embedded memory, 720 I/O, and a 1924-ball FCBGA (45 × 45 mm) package. The device operates from a core supply of 0.95 V to 1.05 V and is rated for commercial temperature operation from 0 °C to 85 °C.
Key Features
- Core Logic Provides 382,464 logic cells and 29,880 logic elements to implement large-scale programmable logic and control structures.
- Embedded Memory Approximately 28.3 Mbits of on-chip RAM to support data buffering, lookup tables, and local storage for complex designs.
- I/O Density 720 I/O pins support extensive external connectivity and parallel interfacing requirements.
- Package & Mounting 1924-ball FCBGA package (45 × 45 mm) in a 1924-BBGA form factor designed for surface-mount assembly.
- Power Core supply range specified at 0.95 V to 1.05 V for device operation.
- Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature.
- Regulatory RoHS compliant.
Unique Advantages
- High logic capacity: 382,464 logic cells support designs with substantial combinational and sequential logic requirements.
- Significant on-chip memory: Approximately 28.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Extensive I/O count: 720 I/O pins enable broad peripheral and interface integration without immediate need for external multiplexing.
- Dense, surface-mount package: 1924-ball FCBGA (45 × 45 mm) allows a compact board footprint while providing a high pin count.
- Commercial operating range: Specified 0 °C to 85 °C temperature rating aligns with standard commercial embedded applications.
- RoHS compliant: Meets lead-free and restricted-substance requirements for commercial products.
Why Choose XC6VHX380T-1FFG1923C?
The XC6VHX380T-1FFG1923C positions itself as a high-capacity, commercially rated FPGA suitable for complex, high-density designs that require large logic resources, ample on-chip memory, and a high I/O count. Its 1924-ball FCBGA package provides a dense integration option for compact system boards.
Designers and procurement teams seeking a commercially graded Virtex-6 HXT device with verifiable logic, memory, I/O, and package specifications will find this part appropriate for scalable, high-performance programmable logic implementations backed by AMD's product family documentation.
Request a quote or submit a quote for the XC6VHX380T-1FFG1923C to receive pricing and availability information specific to your project needs.

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