XC6VCX75T-2FFG784I

The XC6VCX75T-2FFG784I is a Virtex®-6 CXT field programmable gate array (FPGA) in a 784‑ball FCBGA package, manufactured by AMD. It delivers a large logic fabric and on‑chip memory with 360 user I/Os and is specified for industrial temperature operation.

With approximately 74,496 logic elements and roughly 5.75 Mbits of embedded memory, this device is suited to complex, programmable digital designs that require a balance of logic resources, I/O density and temperature resilience. The device operates from a 0.95–1.05 V core supply.

Key Features

• Logic Capacity  Approximately 74,496 logic elements to implement sizeable combinational and sequential logic blocks within a single FPGA.
• Embedded Memory  Approximately 5.75 Mbits of on‑chip RAM for buffering, FIFOs and local data storage needs.
• I/O Density  360 user I/Os to support multiple external interfaces and board-level connectivity.
• Power and Core Voltage  Core supply range of 0.95 V to 1.05 V for the FPGA core domain.
• Package and Mounting  784‑ball FCBGA (29 mm × 29 mm) surface‑mount package providing a compact footprint for high‑density board designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• RoHS Compliance  Environmentally compliant with RoHS requirements.

Typical Applications

• High‑density digital processing  Use the large logic capacity and embedded memory to implement complex signal processing, data path and control algorithms on a single device.
• Industrial control systems  The industrial temperature rating and robust I/O count are suited to PLCs, motion control and automation interfaces.
• Communications and networking  Deployable for protocol bridging, packet processing and interface aggregation where significant logic and local memory are required.
• Test and measurement equipment  Ideal for instrument control, data capture and real‑time processing applications that need deterministic FPGA resources.

Unique Advantages

• Substantial on‑chip resources: Approximately 74,496 logic elements and ~5.75 Mbits of embedded RAM reduce the need for external logic and memory components.
• High I/O count: 360 user I/Os enable flexible interfacing with sensors, transceivers and peripheral devices without excessive board complexity.
• Industrial‑grade thermal range: Specified for −40 °C to 100 °C operation to support deployments in demanding ambient conditions.
• Compact, high‑density package: The 784‑ball FCBGA (29×29 mm) package balances a small PCB footprint with high pin count for complex designs.
• Low‑voltage core: Operates from a 0.95–1.05 V core supply to align with modern low‑voltage power domains.
• Regulatory compliance: RoHS compliant for environmentally conscious designs.

Why Choose XC6VCX75T-2FFG784I?

The XC6VCX75T-2FFG784I positions itself as a capacity-focused Virtex‑6 CXT FPGA that combines a large logic fabric, substantial embedded memory and a high I/O count in a compact 784‑ball FCBGA package. Its industrial temperature rating and RoHS compliance make it appropriate for robust embedded and industrial designs requiring on‑device resources.

This device is well suited for engineers developing complex digital systems that need significant programmable logic and local RAM while maintaining a small board footprint and operating across a wide temperature range.

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