XC6VCX195T-1FFG1156C
| Part Description |
Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 600 12681216 199680 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,097 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 15600 | Number of Logic Elements/Cells | 199680 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12681216 |
Overview of XC6VCX195T-1FFG1156C – Virtex®-6 CXT FPGA, 199,680 logic elements, 600 I/O
The XC6VCX195T-1FFG1156C is a Virtex®-6 CXT field programmable gate array (FPGA) IC from AMD, designed for high-density programmable logic integration. With 199,680 logic elements, approximately 12.68 Mbits of embedded memory and 600 user I/O pins, this device targets designs that require substantial on-chip logic, memory buffering and broad external connectivity.
Packaged in a 1156-ball FCBGA (35×35) surface-mount package and rated for commercial operation, the device provides a compact platform for complex digital system implementation where defined core supply and temperature ranges are required.
Key Features
- Logic Capacity 199,680 logic elements for implementing large, complex digital designs without external programmable logic expansion.
- Embedded Memory Approximately 12.68 Mbits of on-chip RAM to support data buffering, FIFOs and local storage for algorithm acceleration.
- I/O Density 600 user I/O pins to interface with multiple peripherals, sensors, and high-pin-count subsystems.
- Power Supply Range Defined core voltage requirement of 0.95 V to 1.05 V to support consistent device operation within specified rails.
- Package and Mounting 1156-ball BGA (1156-FCBGA, 35×35) package in a surface-mount form factor for compact board designs and high I/O routing density.
- Operating Range & Compliance Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment in standard commercial applications.
Typical Applications
- Complex digital logic integration — Implement large-scale state machines, protocol handling and custom compute pipelines using the device’s 199,680 logic elements.
- Memory-intensive processing — Use the approximately 12.68 Mbits of embedded RAM for buffering, line storage and intermediate data processing.
- High-pin-count interfacing — Leverage 600 I/O pins to connect multiple sensors, parallel interfaces or extensive peripheral arrays.
- Compact system boards — The 1156-FCBGA surface-mount package supports dense PCB layouts where board real estate and routing density matter.
Unique Advantages
- High on-chip logic density: 199,680 logic elements reduce the need for external logic devices and simplify system architecture.
- Significant embedded memory: Approximately 12.68 Mbits of RAM enables local storage for latency-sensitive operations and data staging.
- Extensive external connectivity: 600 I/O pins allow flexible interfacing options for complex multi-device systems.
- Defined power envelope: A clear core voltage range (0.95–1.05 V) helps designers plan power distribution and sequencing.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.
- RoHS compliant: Meets lead-free and restricted substance requirements for compliant product designs.
Why Choose XC6VCX195T-1FFG1156C?
The XC6VCX195T-1FFG1156C positions itself as a high-capacity FPGA solution for designers needing substantial programmable logic, on-chip memory and broad I/O in a compact surface-mount BGA package. Its combination of nearly 200k logic elements and roughly 12.68 Mbits of RAM makes it well suited for demanding digital integration tasks where consolidation of functions onto a single device reduces system complexity.
Ideal for engineering teams building complex prototypes, data buffering stages, or high-pin-count interface systems, this Virtex®-6 CXT device delivers a verifiable set of electrical, thermal and packaging specifications to support predictable design and procurement decisions.
Request a quote or submit a sales inquiry to get pricing and availability for the XC6VCX195T-1FFG1156C. Request details on lead times, packaging options and volume pricing to support your project planning.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








