XC6VCX195T-1FFG1156C

IC FPGA 600 I/O 1156FCBGA
Part Description

Virtex®-6 CXT Field Programmable Gate Array (FPGA) IC 600 12681216 199680 1156-BBGA, FCBGA

Quantity 1,097 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs15600Number of Logic Elements/Cells199680
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12681216

Overview of XC6VCX195T-1FFG1156C – Virtex®-6 CXT FPGA, 199,680 logic elements, 600 I/O

The XC6VCX195T-1FFG1156C is a Virtex®-6 CXT field programmable gate array (FPGA) IC from AMD, designed for high-density programmable logic integration. With 199,680 logic elements, approximately 12.68 Mbits of embedded memory and 600 user I/O pins, this device targets designs that require substantial on-chip logic, memory buffering and broad external connectivity.

Packaged in a 1156-ball FCBGA (35×35) surface-mount package and rated for commercial operation, the device provides a compact platform for complex digital system implementation where defined core supply and temperature ranges are required.

Key Features

  • Logic Capacity 199,680 logic elements for implementing large, complex digital designs without external programmable logic expansion.
  • Embedded Memory Approximately 12.68 Mbits of on-chip RAM to support data buffering, FIFOs and local storage for algorithm acceleration.
  • I/O Density 600 user I/O pins to interface with multiple peripherals, sensors, and high-pin-count subsystems.
  • Power Supply Range Defined core voltage requirement of 0.95 V to 1.05 V to support consistent device operation within specified rails.
  • Package and Mounting 1156-ball BGA (1156-FCBGA, 35×35) package in a surface-mount form factor for compact board designs and high I/O routing density.
  • Operating Range & Compliance Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment in standard commercial applications.

Typical Applications

  • Complex digital logic integration — Implement large-scale state machines, protocol handling and custom compute pipelines using the device’s 199,680 logic elements.
  • Memory-intensive processing — Use the approximately 12.68 Mbits of embedded RAM for buffering, line storage and intermediate data processing.
  • High-pin-count interfacing — Leverage 600 I/O pins to connect multiple sensors, parallel interfaces or extensive peripheral arrays.
  • Compact system boards — The 1156-FCBGA surface-mount package supports dense PCB layouts where board real estate and routing density matter.

Unique Advantages

  • High on-chip logic density: 199,680 logic elements reduce the need for external logic devices and simplify system architecture.
  • Significant embedded memory: Approximately 12.68 Mbits of RAM enables local storage for latency-sensitive operations and data staging.
  • Extensive external connectivity: 600 I/O pins allow flexible interfacing options for complex multi-device systems.
  • Defined power envelope: A clear core voltage range (0.95–1.05 V) helps designers plan power distribution and sequencing.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.
  • RoHS compliant: Meets lead-free and restricted substance requirements for compliant product designs.

Why Choose XC6VCX195T-1FFG1156C?

The XC6VCX195T-1FFG1156C positions itself as a high-capacity FPGA solution for designers needing substantial programmable logic, on-chip memory and broad I/O in a compact surface-mount BGA package. Its combination of nearly 200k logic elements and roughly 12.68 Mbits of RAM makes it well suited for demanding digital integration tasks where consolidation of functions onto a single device reduces system complexity.

Ideal for engineering teams building complex prototypes, data buffering stages, or high-pin-count interface systems, this Virtex®-6 CXT device delivers a verifiable set of electrical, thermal and packaging specifications to support predictable design and procurement decisions.

Request a quote or submit a sales inquiry to get pricing and availability for the XC6VCX195T-1FFG1156C. Request details on lead times, packaging options and volume pricing to support your project planning.

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