XC6VCX130T-1FFG784I

The XC6VCX130T-1FFG784I is a Virtex®-6 CXT family field programmable gate array (FPGA) IC from AMD, provided in a 784-ball FCBGA package. It delivers high logic density and on-chip memory paired with a large I/O count for complex, programmable digital designs.

Designed for industrial-grade deployments, this device combines 128,000 logic elements, approximately 9.73 Mbits of embedded memory, and 400 I/O pins, making it suitable for designs that require substantial programmable resources and extended operating temperature capability.

Key Features

• Core Logic  128,000 logic elements provide a high-density fabric for implementing complex digital processing, custom accelerators, and glue-logic integration.
• Embedded Memory  Approximately 9.73 Mbits of on-chip RAM supports buffering, FIFOs, and local data storage to reduce external memory bandwidth requirements.
• I/O Capacity  400 I/O pins enable broad interfacing options for parallel buses, serdes attachment, and multi-channel connectivity without additional glue logic.
• Power Supply  Core operating voltage range of 950 mV to 1.05 V, suitable for the device's specified power domains and system-level power planning.
• Package and Mounting  784-ball FCBGA package (29 × 29) in a 784-BBGA form factor, designed for surface-mount PCB assembly and high-density board layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, enabling deployment in industrial environments with extended temperature requirements.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation  Use the device's large logic capacity and industrial temperature rating to implement real-time control algorithms, motor control interfaces, and deterministic I/O aggregation.
• High-Density Logic and Custom Acceleration  Deploy as a platform for custom data-paths, hardware accelerators, and protocol offload functions that benefit from significant on-chip logic and memory resources.
• Communications and Networking Equipment  Leverage the 400 I/Os and embedded memory for protocol handling, packet buffering, and multi-port interfacing in communication systems.

Unique Advantages

• High Logical Integration: 128,000 logic elements reduce the need for multiple discrete devices, simplifying system architecture and lowering BOM complexity.
• Substantial On-Chip Memory: Approximately 9.73 Mbits of embedded RAM enables local buffering and state storage to improve throughput and reduce external memory dependence.
• Extensive I/O Count: 400 I/Os provide flexibility for direct connections to a wide range of peripherals and interfaces without additional interface chips.
• Industrial Thermal Range: Rated operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments common in industrial systems.
• Compact, Surface-Mount Packaging: 784-ball FCBGA (29 × 29) supports high-density PCB layouts while remaining compatible with standard surface-mount assembly processes.
• Regulatory Compliance: RoHS compliance aligns the device with common environmental requirements for electronic assemblies.

Why Choose XC6VCX130T-1FFG784I?

The XC6VCX130T-1FFG784I positions itself as a high-density, industrial-grade FPGA choice for designs that require large amounts of programmable logic, significant embedded memory, and a high I/O count within a compact package. Its voltage and temperature specifications make it suitable for systems that demand reliable operation across a wide range of conditions.

Engineers and procurement teams seeking a scalable, resource-rich FPGA for industrial applications will find this Virtex®-6 CXT device provides a balance of logic capacity, on-chip memory, and connectivity to address complex control, communications, and custom-acceleration requirements.

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