XC6VCX130T-1FFG484C

The XC6VCX130T-1FFG484C is a Virtex®-6 CXT FPGA from AMD designed for high-density programmable logic applications. It combines a large number of configurable logic resources, substantial embedded memory, and a high I/O count in a compact BGA package to support complex digital designs.

This device targets commercial-grade designs that require extensive on-chip logic and memory capacity while operating within standard commercial temperature and voltage ranges.

Key Features

• High-density logic 128,000 logic elements and 10,000 CLBs provide extensive programmable logic resources for complex custom circuits and state machines.
• Embedded memory Approximately 9.73 Mbits of on-chip RAM to support buffering, lookup tables, and other memory-intensive functions without external RAM.
• I/O capacity 240 I/O pins enable flexible interfacing with peripherals, sensors, and external devices.
• Package and mounting 484-BBGA package (Supplier device package: 484-FBGA (23×23)) with surface-mount mounting type for compact board integration.
• Core voltage range Nominal supply operation from 950 mV to 1.05 V to match system power rails.
• Commercial temperature grade Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Regulatory compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom digital logic and prototyping Use the device’s 128,000 logic elements and 10,000 CLBs to implement and iterate complex FPGA-based designs and proof-of-concept systems.
• Memory-intensive on-chip processing Approximately 9.73 Mbits of embedded RAM supports on-chip buffering, LUT-based data processing, and temporary storage without immediate external memory needs.
• High-density I/O interfacing 240 I/O pins enable aggregation and routing of multiple external signals, sensors, and peripherals for system integration tasks.

Unique Advantages

• High logic capacity: 128,000 logic elements and 10,000 CLBs allow implementation of large-scale custom logic without partitioning across multiple devices.
• Substantial embedded memory: Approximately 9.73 Mbits of on-chip RAM reduces dependence on external memory for many buffering and LUT requirements.
• Ample I/O resources: 240 I/O pins provide flexibility for complex interfacing and multiple peripheral connections.
• Compact BGA footprint: 484-BBGA (484-FBGA 23×23) package and surface-mount mounting enable dense board layouts and effective use of PCB area.
• Standard commercial operating range: Rated 0 °C to 85 °C, matching typical commercial deployments and test environments.
• RoHS compliant: Meets common environmental compliance requirements for electronics manufacturing.

Why Choose XC6VCX130T-1FFG484C?

The XC6VCX130T-1FFG484C positions itself as a high-density, memory-capable Virtex‑6 CXT FPGA suited for commercial designs that need extensive programmable logic, significant on-chip RAM, and broad I/O capability in a compact BGA package. Its combination of 128,000 logic elements, approximately 9.73 Mbits of embedded memory, and 240 I/Os makes it a practical option for system designers consolidating functionality onto a single FPGA device.

Manufactured by AMD and supplied in a 484-BBGA surface-mount package, this device offers a balance of integration and compactness for complex digital designs where logic density and on-chip memory are priorities.

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