XC6SLX9-N3FTG256C

The XC6SLX9-N3FTG256C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD, supplied in a 256‑LBGA (256‑FTBGA, 17×17) surface‑mount package. It provides mid-range programmable logic capacity, embedded memory, and a substantial I/O count for commercial applications.

Designed for commercial‑grade designs operating from 0 °C to 85 °C, this device addresses use cases that require up to 9,152 logic elements, approximately 0.59 Mbits of embedded RAM, and up to 186 I/Os within a compact package and low-voltage core supply.

Key Features

• Core and Logic Capacity Up to 9,152 logic elements to implement custom digital logic, state machines, and mid-density programmable systems.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM for data buffering, FIFOs, and small embedded memories without external parts.
• I/O Density 186 I/Os to support multiple peripheral interfaces and parallel connections on space-constrained boards.
• Power Core voltage supply range of 1.14 V to 1.26 V for standard low‑voltage FPGA operation.
• Package and Mounting 256‑LBGA (supplier package: 256‑FTBGA, 17×17) surface‑mount package for compact PCB designs.
• Commercial Temperature Range Rated for operation from 0 °C to 85 °C, suitable for a wide range of commercial electronic products.
• RoHS Compliant Meets RoHS requirements for lead‑free manufacturing and regulatory compliance in many markets.

Typical Applications

• Custom digital logic and prototyping — Use the device's 9,152 logic elements and embedded RAM for mid‑density custom logic, algorithm prototyping, and control functions.
• I/O‑intensive interfacing — Leverage up to 186 I/Os to connect multiple peripherals, sensors, or parallel interfaces on a single FPGA.
• Compact board designs — The 256‑LBGA surface‑mount package supports space‑constrained PCBs where a high I/O count and embedded resources are needed.
• Commercial product lines — Suitable for commercial applications requiring RoHS compliance and operation across a 0 °C–85 °C temperature window.

Unique Advantages

• Balanced mid‑range capacity: 9,152 logic elements provide a practical tradeoff between resource availability and board cost for many commercial designs.
• On‑chip memory reduces BOM: Approximately 0.59 Mbits of embedded RAM minimizes the need for external memory in buffering and small data storage tasks.
• High I/O count: 186 I/Os enable versatile interfacing and reduce the need for external I/O expanders.
• Compact surface‑mount package: 256‑LBGA (17×17) allows dense PCB integration while maintaining a high pin count.
• Low‑voltage core operation: 1.14 V to 1.26 V core supply supports standard low‑voltage FPGA designs common in commercial electronics.
• Regulatory readiness: RoHS compliance supports lead‑free manufacturing requirements.

Why Choose XC6SLX9-N3FTG256C?

The XC6SLX9-N3FTG256C combines a practical logic element count, embedded memory, and a high I/O complement in a compact 256‑LBGA surface‑mount package, making it well suited for commercial designs where board space, I/O flexibility, and on‑chip resources matter. Its 0 °C–85 °C rating and RoHS compliance align with common commercial product requirements.

This FPGA is appropriate for engineers and product teams targeting mid‑density programmable solutions that need a balanced mix of logic, memory, and I/O without external component overhead, while maintaining standard commercial operating conditions.

Request a quote or submit an inquiry to get pricing and availability for the XC6SLX9-N3FTG256C for your next design project.