XC6SLX9-N3CSG324C

IC FPGA 200 I/O 324CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 200 589824 9152 324-LFBGA, CSPBGA

Quantity 361 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LFBGA, CSPBGANumber of I/O200Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs715Number of Logic Elements/Cells9152
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX9-N3CSG324C – Spartan®-6 LX FPGA, 324-CSPBGA

The XC6SLX9-N3CSG324C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD supplied in a 324-pin CSPBGA package. It provides approximately 9,152 logic elements and roughly 0.59 Mbits of embedded memory, making it suitable for moderate-density programmable logic implementations.

With 200 I/O pins, commercial-grade temperature range, and a narrow supply voltage window, this surface-mount FPGA targets designs that require compact packaging, integrated on-chip memory, and a sizeable I/O count within a commercial temperature environment.

Key Features

  • Programmable Logic Density  Approximately 9,152 logic elements for implementing custom combinational and sequential logic functions.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support buffering, state storage, and small data structures directly in the FPGA fabric.
  • I/O Resources  200 I/O pins to support connectivity to external peripherals, interfaces, and system-level signals.
  • Core Voltage Range  Operates from 1.14 V to 1.26 V for core power, allowing predictable supply provisioning in system designs.
  • Package and Mounting  324-LFBGA / 324-CSPBGA (15×15) surface-mount package for compact board-level integration.
  • Operating Temperature  Commercial grade operation from 0 °C to 85 °C suitable for standard consumer and commercial applications.
  • Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • Balanced Logic and Memory  Combines ~9,152 logic elements with ~0.59 Mbits of embedded RAM to support medium-complexity control, data-path, and buffering tasks on a single device.
  • High I/O Count  200 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or buses without external I/O expanders.
  • Compact CSPBGA Packaging  The 324-CSPBGA (15×15) package enables dense PCB layouts where board space is constrained.
  • Commercial Temperature Rating  Rated for 0 °C to 85 °C, matching typical requirements for consumer and commercial electronic products.
  • Predictable Power Requirements  A defined core voltage window (1.14 V–1.26 V) simplifies power supply design and margin planning.
  • RoHS Compliant  Meets common lead-free manufacturing and environmental requirements.

Why Choose XC6SLX9-N3CSG324C?

The XC6SLX9-N3CSG324C positions itself as a compact, commercial-grade Spartan®-6 LX FPGA option that balances logic capacity, embedded memory, and I/O resources in a 324-pin CSPBGA package. It is well suited to engineers and designers who need a moderate-density programmable logic device with a significant number of I/Os and on-chip RAM while maintaining a small board footprint.

Its defined operating voltage range and commercial temperature rating make it appropriate for stable, production-focused designs where predictable supply and environmental requirements are important. The RoHS-compliant surface-mount package supports modern assembly flows and compact system integration.

Request a quote or contact sales to check availability and pricing for the XC6SLX9-N3CSG324C.

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