XC6SLX9-L1TQG144I

IC FPGA 102 I/O 144TQFP
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 102 589824 9152 144-LQFP

Quantity 913 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O102Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs715Number of Logic Elements/Cells9152
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX9-L1TQG144I – Spartan®-6 LX FPGA, 9152 logic elements, 144-LQFP

The XC6SLX9-L1TQG144I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, provided in a 144-lead LQFP package. It combines a mid-range logic capacity with embedded RAM and a flexible I/O count to support industrial-grade embedded designs.

With 9,152 logic elements, approximately 0.59 Mbits of on-chip RAM and a core voltage window of 1.14 V to 1.26 V, this device targets applications that require integrated programmable logic, moderate on-chip memory, and operation across an extended temperature range.

Key Features

  • Core Family  Spartan®-6 LX FPGA architecture in the XC6SLX9-L1TQG144I part.
  • Logic Capacity  9,152 logic elements to implement mid-range combinational and sequential logic functions.
  • Programmable Logic Blocks  715 CLBs for structured logic implementation and design partitioning.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 total RAM bits) for data buffering and local storage.
  • I/O Resources  102 user I/O pins to interface with peripherals and external devices.
  • Power  Core supply voltage range of 1.14 V to 1.26 V for low-voltage system integration.
  • Package & Mounting  144-LQFP package (supplier package 144-TQFP, 20 × 20 mm) in a surface-mount form factor for compact PCB layouts.
  • Operating Range & Grade  Industrial grade operation from −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • Balanced logic and memory  The combination of 9,152 logic elements and approximately 0.59 Mbits of embedded RAM enables integration of control logic with local data storage on a single device.
  • Industrial-temperature capability  Rated −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
  • Ample I/O count  102 I/O pins provide flexibility for connecting multiple peripherals and interfaces without immediate need for external multiplexing.
  • Compact surface-mount package  The 144-LQFP (20 × 20 mm supplier TQFP) package supports dense board designs and efficient PCB routing.
  • Low-voltage core operation  A narrow core voltage window (1.14–1.26 V) simplifies power-rail planning for low-voltage systems.
  • Regulatory compliance  RoHS compliance aligns with common environmental requirements for electronic assemblies.

Why Choose XC6SLX9-L1TQG144I?

The XC6SLX9-L1TQG144I positions itself as a practical mid-range FPGA option from AMD, offering a clear balance of logic resources, on-chip memory, and I/O in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for robust embedded applications that require predictable electrical and thermal performance.

This device is well suited for engineers and procurement teams specifying a programmable logic device with defined logic capacity (9,152 logic elements), substantial embedded RAM, and a 102-pin I/O footprint, all while operating within a low-voltage core supply range and an extended temperature envelope.

Request a quote or submit a pricing inquiry today to get availability and pricing details for the XC6SLX9-L1TQG144I.

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