XC6SLX9-L1FT256I

The XC6SLX9-L1FT256I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD in a 256-LBGA package. It provides 9,152 logic elements, approximately 0.59 Mbits of embedded memory, and up to 186 general-purpose I/O lines for configurable digital logic implementations.

Rated for industrial operation and designed for surface-mount assembly, this device targets industrial embedded systems and control applications that require reconfigurable logic, a wide operating temperature range, and a compact footprint.

Key Features

• Core Logic 9,152 logic elements implemented across 715 configurable logic blocks (CLBs) for implementing custom digital functions and state machines.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM to store buffers, lookup tables, and small data structures for low-latency processing.
• I/O Density Up to 186 I/O pins to interface with sensors, peripherals, and external logic without extensive external glue logic.
• Power Supply Core supply operating range of 1.14 V to 1.26 V to match system power budgets and regulator designs.
• Package & Mounting Supplied in a 256-LBGA (supplier package: 256-FTBGA, 17×17) for compact PCB integration; surface-mount mounting type supports modern assembly processes.
• Industrial Temperature Range Guaranteed operation from −40°C to 100°C for deployment in industrial environments and temperature-variable installations.
• Regulatory Status RoHS compliant for simplified integration into assemblies with regulatory requirements for hazardous substance reduction.

Typical Applications

• Industrial Automation — Implement control logic, I/O aggregation, and sequencing for factory equipment using the device’s industrial temperature rating and high I/O count.
• Embedded Control Systems — Create custom state machines and control algorithms using the available logic elements and on-chip RAM for compact embedded designs.
• Sensor and Actuator Interfaces — Route and condition multiple sensor signals and drive actuators directly with the device’s large number of I/O pins and reconfigurable logic.
• Protocol Bridging and Glue Logic — Consolidate protocol conversion and interface logic into a single FPGA to reduce board-level components and simplify system architecture.

Unique Advantages

• Flexible Logic Capacity: 9,152 logic elements allow implementation of a wide range of custom digital functions without external ASICs.
• Compact, High‑Density Package: 256-LBGA packaging provides a small board footprint while preserving significant I/O and logic resources.
• Industrial‑Grade Operation: −40°C to 100°C operating range supports deployment in temperature-variable industrial environments.
• Rich I/O Resources: 186 I/O pins enable direct interfacing with multiple sensors, peripherals, and external devices, reducing the need for additional interface chips.
• On‑Chip Memory: Approximately 0.59 Mbits of embedded RAM supports buffering, LUTs, and small data storage close to logic for low-latency operation.
• RoHS Compliant: Facilitates integration into assemblies requiring hazardous-substance compliance.

Why Choose XC6SLX9-L1FT256I?

The XC6SLX9-L1FT256I positions itself as a compact, industrial-grade FPGA solution that balances programmable logic capacity, embedded memory, and substantial I/O in a 256-LBGA package. Its specification set is suited to designers looking to consolidate discrete logic, interface functions, and control algorithms into a single, reconfigurable device.

This part is well matched to engineering teams designing industrial embedded systems, control panels, and I/O-intensive applications that require reliable operation across a wide temperature range, compact board integration, and RoHS compliance.

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