XC6SLX9-L1CSG225I

IC FPGA 160 I/O 225CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 160 589824 9152 225-LFBGA, CSPBGA

Quantity 42 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package225-CSPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case225-LFBGA, CSPBGANumber of I/O160Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs715Number of Logic Elements/Cells9152
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX9-L1CSG225I – Spartan®-6 LX FPGA, 9152 logic elements, 160 I/Os

The XC6SLX9-L1CSG225I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) in a 225-pin CSPBGA/LFBGA package. It provides 9,152 logic elements and approximately 0.59 Mbits of embedded memory alongside 160 user I/Os, delivering a compact programmable-logic option for designs that require mid-range logic capacity with robust I/O integration.

With an industrial operating temperature range and a narrow core supply voltage window, this device is tailored for applications that demand stable, predictable operation across extended temperature conditions and a compact surface-mount package footprint.

Key Features

  • Logic Capacity 9,152 logic elements (715 CLBs) to implement custom digital logic, state machines, and control functions.
  • Embedded Memory Approximately 0.59 Mbits of on-chip RAM for buffering, small data storage, and local state retention.
  • I/O Resources 160 user I/Os to support a variety of external interfaces and peripheral connections.
  • Power Core voltage supply range of 1.14 V to 1.26 V for precise power domain management.
  • Package & Mounting 225-LFBGA / 225-CSPBGA (13×13) surface-mount package providing a compact, board-space-efficient footprint.
  • Operating Temperature Industrial-grade operation from −40 °C to 100 °C for extended-environment deployments.
  • Compliance RoHS compliant for environmental and manufacturing requirements.

Typical Applications

  • Industrial Control Use the device for programmable control logic and I/O aggregation in systems that operate across −40 °C to 100 °C.
  • Interface Bridging Implement protocol conversion and glue logic using the 160 available I/Os and on-chip memory for buffering.
  • Embedded Processing Support Offload custom logic, glue logic, or accelerator blocks in embedded systems leveraging 9,152 logic elements and local RAM.
  • Prototyping and Custom Logic Deploy as a mid-range FPGA platform for development and validation of user-defined digital functions within a compact 225-pin package.

Unique Advantages

  • Compact, high-density logic: 9,152 logic elements in a 225-pin CSPBGA/LFBGA package enable significant logic capability in a small footprint, helping reduce board area.
  • Generous I/O count: 160 user I/Os provide flexibility for connecting multiple peripherals and interfaces without external multiplexing.
  • On-chip memory for local buffering: Approximately 0.59 Mbits of embedded RAM supports data staging and small buffering tasks without external RAM.
  • Industrial-rated operation: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
  • Tight core-voltage window: 1.14 V to 1.26 V supply range enables predictable power design and domain control.
  • RoHS compliant: Meets environmental compliance standards for modern manufacturing requirements.

Why Choose XC6SLX9-L1CSG225I?

The XC6SLX9-L1CSG225I blends mid-range programmable logic capacity with ample I/O and on-chip memory in a compact 225-pin surface-mount package. Its industrial operating temperature range and RoHS compliance make it a practical choice for applications that require reliable operation across extended temperatures while maintaining a small board footprint.

This device is well suited to engineers designing industrial controllers, interface bridges, embedded processing subsystems, or prototype platforms where 9,152 logic elements, 160 I/Os, and approximately 0.59 Mbits of embedded memory provide the right balance of integration and flexibility.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC6SLX9-L1CSG225I.

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