XC6SLX9-N3CSG225I
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 160 589824 9152 225-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,786 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 225-CSPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-LFBGA, CSPBGA | Number of I/O | 160 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 715 | Number of Logic Elements/Cells | 9152 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC6SLX9-N3CSG225I – Spartan®-6 LX FPGA, 225-CSPBGA (13×13)
The XC6SLX9-N3CSG225I is an AMD Spartan®-6 LX field programmable gate array (FPGA) supplied in a 225-pin CSPBGA package. It provides 9,152 logic elements and approximately 0.59 Mbits of embedded memory, along with 160 user I/O pins for flexible system integration.
Designed for industrial-grade operation, this device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, making it suitable for designs that require temperature robustness and compact package options.
Key Features
- Logic Density — Provides 9,152 logic elements, enabling moderate-complexity custom logic and control functions within a compact FPGA.
- Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for buffering, state storage, and small data structures.
- I/O Capability — 160 user I/O pins to support multiple interfaces and peripheral connections in a single device.
- Power — Operates from a 1.14 V to 1.26 V core supply, suitable for low-voltage system architectures.
- Package and Mounting — Supplied in a 225-LFBGA / 225-CSPBGA (13×13) package for surface-mount assembly and space-constrained board layouts.
- Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for deployments in demanding environments.
- Compliance — RoHS compliant for environmentally responsible electronics manufacturing.
Unique Advantages
- Balanced Logic and Memory — 9,152 logic elements combined with approximately 0.59 Mbits of embedded RAM provide a balanced resource set for control, signal processing, and glue-logic tasks.
- Flexible I/O Count — 160 I/O pins allow consolidation of multiple interfaces onto a single FPGA, reducing external component count.
- Compact, High-Density Package — The 225-CSPBGA (13×13) package delivers a small footprint for space-constrained designs while maintaining robust soldered connections.
- Industrial Reliability — Rated for -40 °C to 100 °C operation to meet the environmental demands of industrial applications.
- Low-Voltage Operation — 1.14 V to 1.26 V supply range supports integration into modern, low-voltage power architectures.
- RoHS Compliance — Meets lead-free manufacturing requirements for global electronics production.
Why Choose XC6SLX9-N3CSG225I?
The XC6SLX9-N3CSG225I positions itself as an industrial-grade Spartan®-6 LX FPGA that combines moderate logic density, embedded memory, and a substantial I/O count in a compact 225-CSPBGA package. Its operating voltage range and extended temperature rating make it suitable for designs that require a reliable, space-efficient programmable logic solution.
This device is a fit for developers and procurement teams looking for an FPGA that balances integration and environmental robustness, enabling consolidation of control and interface functions while adhering to RoHS requirements.
Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX9-N3CSG225I. Our team can provide the details you need to move forward with procurement and design planning.

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