XC6VCX130T-1FFG1156I

The XC6VCX130T-1FFG1156I is a Virtex®-6 CXT Field Programmable Gate Array supplied in a 1156-FCBGA (35×35) package and specified for industrial-grade operation. It provides a combination of a large logic fabric, substantial on-chip RAM, and a high I/O count for complex, dense digital designs that require reliable operation across a broad temperature range.

Key device characteristics include 128,000 logic elements, approximately 9.73 Mbits of embedded memory, 600 I/O, a 950 mV to 1.05 V core supply range, and an operating temperature span from −40 °C to 100 °C, supporting integration into demanding industrial systems.

Key Features

• Core Logic 128,000 logic elements and 10,000 configurable logic blocks (CLBs) provide the programmable fabric for implementing complex digital functions.
• Embedded Memory Approximately 9.73 Mbits of on-chip RAM to support large buffering, state storage, and data-path requirements without external memory.
• I/O Capacity 600 I/O pins to support wide parallel interfaces, multiple high-pin-count peripherals, and extensive system connectivity.
• Power Core voltage specified from 950 mV to 1.05 V to match system power rails and enable predictable power budgeting.
• Package & Mounting 1156-BBGA / 1156-FCBGA (35×35) package in a surface-mount form factor for high-density board integration.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.

Unique Advantages

• High logic density: 128,000 logic elements and 10,000 CLBs enable large-scale digital implementations without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 9.73 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level design.
• Extensive I/O capability: 600 I/O pins provide flexibility for interfacing with numerous peripherals, sensors, and high-pin-count subsystems.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in industrial and temperature-variable environments.
• Compact, high-density packaging: 1156-FCBGA (35×35) surface-mount package enables dense PCB layouts while supporting robust signal routing.
• Regulatory-friendly: RoHS compliance supports modern manufacturing and regulatory needs.

Why Choose XC6VCX130T-1FFG1156I?

The XC6VCX130T-1FFG1156I positions itself as a high-capacity, industrial-grade FPGA option for designers who require dense logic resources, ample on-chip memory, and significant I/O in a compact surface-mount FCBGA package. Its specified core voltage range and broad operating temperature make it suitable for demanding embedded applications where predictable electrical and thermal behavior is important.

This device is appropriate for teams and projects that need scalable programmable logic with robust integration options and environmental tolerance, providing long-term value through high integration and reduced board-level complexity.

Request a quote or submit an inquiry to purchase the XC6VCX130T-1FFG1156I and discuss availability and lead times with our sales team.