XC6VCX130T-2FFG1156C

The XC6VCX130T-2FFG1156C is a Virtex®-6 CXT Field Programmable Gate Array (FPGA) in a 1156-BBGA FCBGA package. It delivers a high density of programmable logic, abundant embedded memory, and extensive I/O for applications that require significant on-chip resources within a surface-mount FCBGA footprint.

This commercial-grade device is designed for systems that need up to 128,000 logic elements, approximately 9.7 Mbits of on-chip RAM, and up to 600 I/O signals, while operating within a 0 °C to 85 °C temperature range and a 0.95 V to 1.05 V core supply window.

Key Features

• Core Logic  10000 configurable logic blocks (CLBs) and 128,000 logic elements provide a large fabric for implementing complex digital logic and custom processing engines.
• Embedded Memory  Approximately 9.7 Mbits of on-chip RAM supports buffering, lookup tables, and data staging without relying on external memory for many workloads.
• I/O Capacity  Up to 600 I/O pins enable high interface density for connecting multiple peripherals, buses, and parallel interfaces.
• Power and Voltage  Core supply range of 0.95 V to 1.05 V allows integration with systems designed around this voltage window.
• Package and Mounting  1156-FCBGA (35 × 35 mm) package in a 1156-BBGA format, surface-mount mounting type for compact, board-level integration.
• Operating Range and Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for adherence to common environmental requirements.

Typical Applications

• High-density digital logic — Implement complex state machines, control logic, and custom datapaths using up to 128,000 logic elements and 10,000 CLBs.
• Memory-intensive processing — Use approximately 9.7 Mbits of embedded RAM for on-chip buffering, FIFO memory, or LUT-based structures.
• I/O-rich interface control — Support multiple parallel interfaces, peripheral connections, and high pin-count board designs with up to 600 I/O.
• Commercial embedded systems — Integrate into commercial-grade products that operate within 0 °C to 85 °C and require an FCBGA surface-mount package.

Unique Advantages

• Highly integrated programmable fabric: Large CLB and logic element counts reduce the need for multiple discrete logic devices, simplifying BOM and board complexity.
• Substantial on-chip RAM: Approximately 9.7 Mbits of embedded memory enables significant data buffering and state storage without immediate external memory dependence.
• Extensive connectivity: Up to 600 I/O pins provide design flexibility for complex interfacing and parallel data flows.
• Compact FCBGA package: 1156-FCBGA (35 × 35 mm) supports high-density PCB integration while retaining robust surface-mount assembly compatibility.
• Targeted power window: Defined core supply range (0.95 V–1.05 V) supports predictable power planning and system-level integration.
• RoHS compliant: Meets common environmental directives for lead-free assembly.

Why Choose XC6VCX130T-2FFG1156C?

The XC6VCX130T-2FFG1156C positions itself as a high-density Virtex®-6 CXT FPGA option that balances large programmable logic capacity, considerable on-chip memory, and extensive I/O in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of embedded applications where board space, integration density, and on-chip resources matter.

This device is well suited to design teams and integrators building systems that need significant programmable resources and memory on a single device, enabling consolidation of functions, reduced external components, and a clear upgrade path within designs that leverage Virtex®-6 family characteristics.

Request a quote or submit a purchase inquiry to evaluate the XC6VCX130T-2FFG1156C for your upcoming design and receive pricing and availability details.