XC6SLX9-3FTG256I

The XC6SLX9-3FTG256I is a Spartan®-6 LX field programmable gate array provided in a 256‑LBGA surface-mount package. It delivers approximately 9,152 logic elements and roughly 0.59 Mbits of embedded memory, with 186 user I/O pins and a supplier package footprint of 256‑FTBGA (17 × 17).

Designed and specified for industrial use, the device operates from a core supply range of 1.14 V to 1.26 V and across an operating temperature range of −40 °C to 100 °C. It is RoHS compliant.

Key Features

• Logic Capacity  Approximately 9,152 logic elements for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, FIFOs and local data storage.
• I/O Resources  186 user I/O pins to support multiple interfaces and external device connections.
• Power Supply  Core voltage specified from 1.14 V to 1.26 V to match system power design requirements.
• Package & Mounting  256‑LBGA surface-mount package; supplier device package listed as 256‑FTBGA (17 × 17) for footprint planning.
• Industrial Temperature Range  Rated to operate from −40 °C to 100 °C for deployments in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Industrial-grade temperature rating and extensive I/O make this device suitable for custom control logic, sensor interfacing and factory automation modules.
• Embedded Acceleration  Logic capacity and on-chip RAM enable hardware-accelerated functions and custom processing blocks inside embedded systems.
• I/O Bridging and Protocol Conversion  High I/O count supports implementation of protocol bridges, bus adapters and interface consolidation.
• Prototyping and Custom Logic  Surface-mount 256‑LBGA package and programmable fabric provide a compact platform for validating and deploying custom digital designs.

Unique Advantages

• Balanced Logic and Memory  About 9,152 logic elements combined with ~0.59 Mbits of embedded RAM provide a practical mix for mid-density designs that require both logic and local storage.
• Extensive I/O  186 I/O pins reduce the need for external multiplexing or additional interface ICs, simplifying board-level design.
• Industrial Readiness  Specified operating range of −40 °C to 100 °C and industrial grade designation support deployment in temperature-variable environments.
• Compact Surface-Mount Package  256‑LBGA (256‑FTBGA supplier footprint) delivers a high pin-count solution in a compact, surface-mount form factor for space-constrained PCBs.
• Low-Voltage Core Operation  Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage system architectures.
• Regulatory Compliance  RoHS compliance supports environmentally conscious product builds and regulatory requirements.

Why Choose XC6SLX9-3FTG256I?

The XC6SLX9-3FTG256I combines a mid-density FPGA fabric with a practical amount of embedded RAM and a high I/O count in a compact 256‑LBGA package, targeting industrial applications that require configurable logic, reliable operation across a wide temperature range, and a compact board footprint. Its defined supply and environmental specifications make it straightforward to integrate into industrial and embedded system designs.

This part is suited for engineers and procurement teams looking for a programmable device that balances logic resources, on-chip memory and connectivity while meeting industrial temperature and RoHS requirements.

Request a quote to obtain pricing, availability and lead-time information for the XC6SLX9-3FTG256I.