XC6SLX9-3FT256I

The XC6SLX9-3FT256I is a Spartan®-6 LX field programmable gate array (FPGA) supplied in a 256-pin BGA package. It provides a balanced combination of programmable logic, on-chip memory and I/O density for configurable digital designs.

Built for industrial applications, this device offers 9,152 logic elements, approximately 0.59 Mbits of embedded memory and 186 I/O pins, making it suitable for a wide range of embedded and control-oriented implementations.

Key Features

• Core Architecture  Spartan®-6 LX FPGA family device providing 9,152 logic elements for configurable digital logic implementations.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) to support buffering, state machines and small data storage needs.
• I/O Capacity  186 user I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Power  Core supply voltage range of 1.14 V to 1.26 V for the device core domain.
• Package and Mounting  256-LBGA package; supplier device package listed as 256-FTBGA (17×17). Surface-mount type suited for compact PCB layouts.
• Temperature Rating  Industrial operating temperature range from -40 °C to 100 °C for deployments in demanding environments.
• Regulatory Compliance  RoHS compliant for lead-free assembly and environmental conformity.

Typical Applications

• Industrial Control  Programmable logic and I/O routing for control systems that require industrial temperature operation and reliable on-chip memory.
• Embedded Systems  Custom digital processing, state machines and peripheral interfacing using the device’s logic resources and embedded RAM.
• Communications & Networking  I/O-rich implementations where flexible signal routing and moderate embedded memory are needed for protocol handling or buffering.

Unique Advantages

• Balanced Logic and Memory:  9,152 logic elements combined with approximately 0.59 Mbits of embedded RAM provide capability for a variety of control and processing tasks without external memory dependency.
• High I/O Density:  186 I/O pins enable interfacing to numerous peripherals and board-level signals, simplifying system integration.
• Compact, Surface-Mount Package:  256-LBGA / 256-FTBGA (17×17) package supports high-density PCB designs while maintaining a standardized footprint.
• Industrial Temperature Range:  Rated from -40 °C to 100 °C to support designs deployed in extended-temperature environments.
• Low-Voltage Core Operation:  Core supply between 1.14 V and 1.26 V supports modern power-optimized system architectures.
• RoHS Compliant:  Meets lead-free and environmental requirements for contemporary manufacturing processes.

Why Choose XC6SLX9-3FT256I?

The XC6SLX9-3FT256I delivers a practical mix of logic density, embedded memory and I/O count in a compact 256-pin BGA package rated for industrial temperatures. It is positioned for engineers designing configurable digital systems that require reliable operation across a wide temperature range and moderate on-chip resources.

With its combination of 9,152 logic elements, approximately 0.59 Mbits of RAM, 186 I/O and RoHS compliance, this Spartan®-6 LX device offers a straightforward option for embedded control, industrial automation and communications-related designs that benefit from on-device programmability.

Request a quote or submit a procurement inquiry to evaluate XC6SLX9-3FT256I for your next design and confirm availability and pricing.