XC6SLX9-3CSG225C

The XC6SLX9-3CSG225C is a Spartan®-6 LX field programmable gate array (FPGA) offered in a 225-ball CSPBGA surface-mount package. It provides reconfigurable logic resources and on-chip embedded memory, delivered in a commercial-grade device specified for a 0 °C to 85 °C operating range and a 1.14 V to 1.26 V core supply.

Key Features

• Logic Capacity — 9,152 logic elements suitable for implementing combinational and sequential logic in configurable designs.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 total RAM bits) for buffering, lookup tables, and small data storage.
• I/O Resources — 160 user I/O pins to interface with peripherals, sensors, and external devices.
• Package & Mounting — 225-LFBGA (225-CSPBGA, 13 × 13 mm) surface-mount package for compact board integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails within the specified range.
• Operating Temperature — Commercial-grade temperature rating from 0 °C to 85 °C for typical commercial environments.
• Compliance — RoHS compliant, meeting common lead-free manufacturing requirements.

Unique Advantages

• Balanced logic and memory resources: 9,152 logic elements combined with approximately 0.59 Mbits of embedded RAM enable mid-range FPGA designs without external memory for small datasets.
• Ample I/O count: With 160 I/O pins, the device supports multiple parallel interfaces and flexible board-level connectivity.
• Compact CSPBGA footprint: The 225-ball (13 × 13 mm) CSPBGA package reduces PCB area while maintaining a robust surface-mount solution.
• Commercial-grade specification: Specified 0 °C to 85 °C operating range and RoHS compliance make the device suitable for commercial product lines and standard manufacturing processes.
• Known architecture: As a Spartan®-6 LX device from AMD, the part aligns with a well-documented FPGA family for consistent part selection within that series.

Why Choose XC6SLX9-3CSG225C?

The XC6SLX9-3CSG225C delivers a combination of mid-range logic density, on-chip RAM, and a high I/O count in a compact 225-CSPBGA package for commercial-grade designs. It is well suited to engineers who require reconfigurable logic resources with defined electrical and thermal limits—specifically a 1.14 V to 1.26 V core supply and 0 °C to 85 °C operating range.

This part is appropriate for projects where moderate programmable logic capacity, integrated RAM, and a compact board footprint are key selection criteria, while remaining compliant with RoHS manufacturing requirements.

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