XC6SLX9-3CPG196I

The XC6SLX9-3CPG196I is a Spartan®-6 LX Field Programmable Gate Array IC from AMD. It integrates 9,152 logic elements and approximately 0.59 Mbits of embedded memory in a 196-TFBGA / CSBGA package.

Built to industrial grade, this FPGA offers 106 user I/O, a low-voltage core supply range of 1.14 V to 1.26 V, and an operating temperature range of -40 °C to 100 °C, providing a compact, reconfigurable logic resource suitable for temperature-sensitive embedded designs.

Key Features

• Logic Capacity 9,152 logic elements provide programmable resources for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, look-up tables, and temporary storage.
• I/O 106 user I/O pins offer flexible interfacing to external devices and peripherals.
• Power Core supply voltage range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting 196-TFBGA, CSBGA package (supplier package: 196-CSPBGA, 8×8) with surface-mount mounting type for compact board-level integration.
• Temperature & Grade Industrial grade with an operating temperature range from -40 °C to 100 °C for reliable operation in demanding environments.
• Compliance RoHS compliant construction.

Unique Advantages

• Balanced logic and memory: 9,152 logic elements combined with approximately 0.59 Mbits of on-chip RAM enable a mix of combinational and storage resources in a single device.
• Ample I/O count: 106 user I/O pins support multiple peripheral and interface connections without immediate need for external I/O expanders.
• Compact board footprint: 196-TFBGA / CSBGA package and surface-mount mounting reduce PCB area for space-constrained designs.
• Industrial temperature range: Specified operation from -40 °C to 100 °C supports deployments in temperature-challenging environments.
• Low-voltage core: Narrow core supply window (1.14 V to 1.26 V) enables predictable power design for systems targeting low-voltage FPGA cores.
• RoHS compliant: Meets RoHS requirements for environmental and manufacturing compliance.

Why Choose XC6SLX9-3CPG196I?

The XC6SLX9-3CPG196I delivers a practical balance of logic resources, on-chip memory, and a high I/O count in a compact industrial-grade package. Its specified operating temperature range and surface-mount 196-TFBGA footprint make it suitable for embedded systems that require reconfigurable logic with constrained board space.

This device is appropriate for engineers and procurement teams seeking a verified FPGA option with clear electrical and environmental specifications, enabling straightforward integration into industrial and temperature-demanding designs.

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