XC6SLX9-2FTG256I

The XC6SLX9-2FTG256I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD built in a 256-LBGA package. It provides a programmable logic fabric with 9,152 logic elements, approximately 0.59 Mbits of embedded RAM, and up to 186 user I/Os, delivered in a surface-mount 256-FTBGA (17×17) footprint.

With a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, this device is suited to industrial-grade applications that require a balance of programmable capacity, I/O density, and compact packaging.

Key Features

• Logic Capacity — 9,152 logic elements for implementing custom digital logic, state machines, and glue logic within a single FPGA device.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM to support buffering, LUT-based storage, and small data structures without external memory.
• I/O Resources — 186 user I/Os to support multiple interfaces, parallel buses, and mixed-signal front-end connectivity.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting for compact PCB designs.
• Power — Core voltage supply range from 1.14 V to 1.26 V for predictable power planning and rail design.
• Temperature & Grade — Industrial grade operation with an ambient temperature range of −40 °C to 100 °C for robust environmental performance.
• Manufacturer — Produced by AMD, a known provider of programmable devices.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature rating and 186 I/Os enable reliable sensor interfacing, machine control I/O expansion, and deterministic logic in factory and process environments.
• Embedded Signal Processing — 9,152 logic elements and on-chip RAM make the device suitable for compact signal-processing tasks and data-path acceleration within embedded systems.
• Interface Bridging and Custom I/O — High I/O count and compact BGA packaging support protocol bridging, custom interface logic, and board-level integration where space is constrained.

Unique Advantages

• Balanced Logic and Memory: 9,152 logic elements combined with approximately 0.59 Mbits of embedded RAM allow integration of control logic and modest data buffering on-chip.
• High I/O Density: 186 I/Os reduce the need for external I/O expanders and simplify multi-interface designs.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to support deployment in demanding ambient environments.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) enables space-efficient PCB layouts while maintaining robust electrical connections.
• Predictable Power Requirements: Narrow core supply window (1.14 V to 1.26 V) assists in power-rail planning and thermal management.
• Vendor Backing: Manufactured by AMD, providing a clear supply source for procurement and production planning.

Why Choose XC6SLX9-2FTG256I?

The XC6SLX9-2FTG256I positions itself as a practical, industrial-grade FPGA option for designs that require moderate logic capacity, embedded RAM, and substantial I/O in a compact package. Its combination of 9,152 logic elements, approximately 0.59 Mbits of on-chip memory, and 186 I/Os supports integration of control, interfacing, and signal-processing functions without excessive board-level complexity.

This device is appropriate for engineers and procurement teams seeking a surface-mount, industrial-temperature FPGA from AMD that balances programmability, I/O capability, and predictable power and thermal characteristics for medium-scale embedded and control applications.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX9-2FTG256I.