XC6SLX9-2FT256I

IC FPGA 186 I/O 256FTBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 186 589824 9152 256-LBGA

Quantity 1,384 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O186Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs715Number of Logic Elements/Cells9152
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX9-2FT256I – Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 186 589824 9152 256-LBGA

The XC6SLX9-2FT256I is a Spartan®-6 LX field programmable gate array designed for industrial applications requiring flexible, reconfigurable logic. Built around the Spartan-6 LX family, this device provides a balance of logic capacity, embedded memory, and I/O resources for mid-range designs.

With 9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, and 186 user I/O, the device supports a variety of control, signal processing, and interface tasks while operating across an industrial temperature range and a low-voltage supply window.

Key Features

  • Logic Capacity  9,152 logic elements to implement combinational and sequential logic for mid-range FPGA designs.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support data buffering, FIFOs, and small local storage needs.
  • I/O Resources  186 general-purpose I/O pins to support multiple interfaces, sensor and actuator connections, and board-level integration.
  • Power Supply  Operates from a core voltage supply range of 1.14 V to 1.26 V for compatibility with low-voltage system architectures.
  • Package and Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board layouts.
  • Industrial Temperature  Rated for operation from −40 °C to 100 °C to meet the thermal demands of industrial environments.
  • Regulatory Compliance  RoHS compliant for reduced hazardous substance content in assemblies.

Typical Applications

  • Industrial Control  Implement real-time control logic and I/O aggregation using the device’s logic capacity and 186 I/O pins within industrial automation equipment.
  • Embedded Processing  Use on-chip RAM and logic elements for protocol handling, data buffering, and custom peripheral logic in embedded systems.
  • Sensor and Actuator Interfaces  Interface multiple sensors and actuators directly to the FPGA, taking advantage of the broad I/O count and industrial temperature rating.
  • Communications and Bridging  Implement medium-complexity protocol conversion and interface bridging where configurable logic and memory are required.

Unique Advantages

  • Balanced Logic and Memory: 9,152 logic elements combined with approximately 0.59 Mbits of RAM provide a practical mix for a wide range of mid-size designs without over-provisioning.
  • High I/O Density: 186 I/O pins enable direct connection to multiple peripherals and interfaces, reducing the need for external I/O expanders.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation, the device is suited to demanding thermal environments common in industrial applications.
  • Compact Packaging: The 256-LBGA (256-FTBGA, 17×17) surface-mount package supports space-constrained PCB designs while providing necessary ball count for signals and power.
  • Low-Voltage Operation: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage system designs to simplify power supply planning.
  • RoHS Compliant: Helps simplify regulatory compliance for assemblies targeting environmentally conscious markets.

Why Choose XC6SLX9-2FT256I?

The XC6SLX9-2FT256I positions itself as a versatile Spartan-6 LX FPGA option for mid-range industrial designs that need a combination of logic capacity, embedded memory, and substantial I/O in a compact package. Its industrial temperature rating and RoHS compliance make it suitable for deployed equipment where environmental robustness and regulatory alignment matter.

Engineers designing control systems, embedded devices, and interface bridges will find the device’s mix of resources useful for scaling functionality while maintaining straightforward power and packaging requirements. The XC6SLX9-2FT256I offers a practical, verifiable platform for projects that require reconfigurable logic with industrial operating characteristics.

Request a quote or submit a pricing inquiry today to learn more about availability and ordering for the XC6SLX9-2FT256I.

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