XC6SLX9-2FT256C

The XC6SLX9-2FT256C is an AMD Spartan®-6 LX Field Programmable Gate Array supplied in a 256-LBGA package for surface-mount installation. This commercial-grade FPGA delivers a balance of logic capacity, on-chip RAM and I/O density for a wide range of commercial embedded designs.

With 9,152 logic elements, approximately 0.59 Mbits of embedded memory, and 186 I/O pins, the device is suited to applications that require moderate programmable logic, significant on-chip buffering, and a compact 256-ball BGA footprint. The core supply voltage range is 1.14 V to 1.26 V and the device is rated for 0 °C to 85 °C operation and RoHS compliance.

Key Features

• Logic Capacity — 9,152 logic elements provide programmable resources for glue logic, state machines, and custom datapath implementations.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM to support FIFOs, buffers, and small packet/stream storage without external memory.
• I/O Density — 186 user I/Os enable multiple parallel interfaces and signal routing directly from the FPGA package.
• Power and Supply — Core voltage supply range from 1.14 V to 1.26 V to match system power design requirements.
• Package and Mounting — 256-ball LBGA (supplier device package: 256-FTBGA, 17×17) designed for surface-mount PCB assembly, offering a compact footprint for space-constrained boards.
• Commercial Grade Operation — Rated for 0 °C to 85 °C operating temperature suitable for commercial applications.
• Regulatory Compliance — RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Embedded Control — Implement control logic and custom state machines where 9,152 logic elements and on-chip RAM meet moderate complexity requirements.
• I/O Interface Bridging — Use the 186 I/Os to consolidate and translate multiple parallel or serial interfaces within a compact BGA package.
• Data Buffering and Packet Handling — Leverage approximately 0.59 Mbits of embedded RAM for temporary storage, FIFOs, and small packet buffering without external memory.
• Prototyping and Development — Suitable for commercial prototype platforms that require surface-mount assembly and a moderate-density FPGA fabric.

Unique Advantages

• Balanced Logic and Memory: 9,152 logic elements combined with ~0.59 Mbits of embedded RAM provide a practical mix for mid-range programmable designs.
• High I/O Count: 186 user I/Os reduce the need for external interface chips when connecting multiple peripherals or buses.
• Compact BGA Footprint: 256-LBGA (256-FTBGA, 17×17) enables high-density PCB layouts while keeping package area small.
• Commercial Temperature Rating: 0 °C to 85 °C operation aligns with standard commercial electronics deployment requirements.
• RoHS Compliance: Supports lead-free assembly and modern manufacturing processes.
• Defined Core Supply Range: 1.14 V to 1.26 V core supply simplifies power-system integration for designs targeting this voltage domain.

Why Choose XC6SLX9-2FT256C?

The XC6SLX9-2FT256C positions itself as a compact, commercially rated FPGA option within the Spartan‑6 LX family, offering a practical combination of logic resources, on-chip memory and I/O capacity in a 256-ball BGA package. It is well suited to commercial embedded designs that require moderate programmable logic and significant I/O connectivity while maintaining a small PCB footprint.

Choosing this device provides a balance of integration and predictable electrical and thermal limits (1.14 V–1.26 V core and 0 °C–85 °C operation), making it a solid option for teams building commercial products, development platforms, or I/O-focused interface modules.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC6SLX9-2FT256C. Our team can provide lead-time details and support your purchase process.