XC6SLX9-2CSG225I

The XC6SLX9-2CSG225I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD. It provides 9,152 logic elements with 715 configurable logic blocks (CLBs), approximately 0.59 Mbits of embedded memory, and 160 general-purpose I/Os in a compact 225-LFBGA (13×13) CSPBGA package.

Designed for industrial-grade applications, this surface-mount FPGA supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, enabling use in thermally demanding and space-constrained designs.

Key Features

• Core Logic: 9,152 logic elements implemented across 715 configurable logic blocks (CLBs) for custom digital logic and control functions.
• Embedded Memory: Approximately 0.59 Mbits of on-chip RAM for buffering, FIFOs, and small data stores.
• I/O Capacity: 160 user I/O pins to support multiple parallel interfaces and peripheral connections.
• Power: Core voltage supply range of 1.14 V to 1.26 V suitable for low-voltage FPGA designs.
• Package and Mounting: 225-LFBGA (13×13) CSPBGA package in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation for industrial environments.
• Compliance: RoHS-compliant manufacturing to meet environmental requirements.

Typical Applications

• Industrial Control: Use the industrial temperature rating and flexible I/O to implement motor control, PLC logic, and factory automation interfaces.
• Embedded Processing and Glue Logic: Apply the 9,152 logic elements and on-chip memory for custom protocol bridging, control state machines, and peripheral aggregation.
• Compact Board-Level Designs: The 225-LFBGA CSPBGA package and surface-mount mounting enable high-density PCB layouts in space-constrained equipment.

Unique Advantages

• Moderate Logic Density: 9,152 logic elements provide a balance between capability and cost for mid-range FPGA designs.
• Ample I/O Count: 160 I/Os support multiple interfaces and parallel connections without external I/O expanders.
• On-Chip Memory: Approximately 0.59 Mbits of embedded RAM reduce external memory requirements for many control and buffering tasks.
• Industrial Reliability: −40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environments.
• Compact Packaging: 225-LFBGA (13×13) CSPBGA package enables compact, surface-mount integration for modern PCB designs.
• RoHS Compliant: Meets environmental regulatory requirements for lead-free manufacturing.

Why Choose XC6SLX9-2CSG225I?

The XC6SLX9-2CSG225I offers a practical combination of logic capacity, on-chip memory, and I/O resources in a compact industrial-grade package. Its electrical and thermal specifications—1.14 V to 1.26 V core supply and −40 °C to 100 °C operating range—make it suitable for embedded systems and industrial applications where space and reliability matter.

Backed by AMD manufacturing, this FPGA is a fit for engineers seeking a mid-range, programmable solution that balances integration and board-area efficiency while supporting RoHS-compliant production requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX9-2CSG225I for your next design.